Pocket data input board

ABSTRACT

E-Board is a pocket portable, thin, light, small digital data input device, for use primarily by PDAs, cell phones or other mobile communicating computers (MCC). It has several versions, such a one pad or multi pad, integral to or detathcable from MCC or even adhered to and covering the screen of MCC.  
     It can encompass functions such as stylus, scroll, handwriting pad, etc. freeing much needed space for a larger screen. It can act also as MCC cover. Several techniques and devices are introduced that have also uses beyond MCC.

[0001] Truly mobile devices, i.e. small, light that do not require adedicated pocket exist. But they are all very difficult to use. Forexample:

[0002] tiny keypads, can be used by just one finger at a time, usinghigh actuation force

[0003] thumboards using one or two thumbs just as slow, high force andfrustrating

[0004] tiny on screen keyboards, operated by a stylus, one charcter at atime, hence slow

[0005] This category also steals much scarce screen area, reducing thescreen to micro in cell phones and to mini in PDAs.

[0006] To demonstrate inadequacy all current devices put together,consider how less useful and limited a desktop with all such inputs, butwithout a proper keyboard, would be.

[0007] Another category are Foldable and Rollable keyboards. They aremobile but require an extra dedicated pocket. Considering all the otherthing s that have to be carried, that carrying anything bulky in apocket is inconvenient and unsightly, that most shirts have no or justone pocket, and that the overall goal is to be totally free of allentanglements, any additional bulk or any additional pocket isunwelcome.

[0008] Besides they need a desk, can't be used on the go nor held inhand with MCC. Logitek offers a rollable keyboard using ElektricTextile, which wrapps around the MCC. But it almost doubles both theBulk and the Weight of a typical PDA.

[0009] “Mobile” does not mean, by many users, to be just “moving”, butto be “free”, to work, communicate, surf and entertain, anywhere,anytime, without inconvenience. Having to sit down and need of a desk isnot mobile, nor free, nor always possible.

[0010] One category that the applicant regards as the best are “MiniKeyboards”. They occupy a separate pad which flip folds onto the mainbody of the MCC. They are better than most High Actuation Force othersfor being Touch Sensitive. But they have small and crammed keys to fitall needed ones in a small area. This means having to locate each keycarefully, then press it carefully not to activate the adjacent keys,and often having to correct unintended inputs.

[0011] Besides, they add considerable thickness and weight to the MCC.

[0012] Once an MCC exceeds a certain thickness, it becomes undesireable.

[0013] Being slow, inaccurate, thick and heavy, beyond users, toleranceare problems.

[0014] Need for an Pocket Data Input Board

[0015] All above are commendable efforts by inventors, engineers,scientists and manufacturers, to get us one step closer to what isneeded.

[0016] The applicant, in identifying their inadequacies is merelyidentifying need for improvement, as well as complying with“specification” writing protocols.

[0017] Otherwise, the applicant admires all said ingenius devices.

[0018] The fact that so many brilliant attempts have been made by theprovider group, being the inventors, scientists, engineers,manufacturers and distributers proves dire need.

[0019] The fact that so many consumers have adopted some very difficultto use systems, such as “grafitti” or popular use of one thumb to strike3 keys of a cellphone keypad for each character for text messagingreconfirms such dire need for a mobile input.

[0020] The fact that bulky and not true mobile Foldable keyboards soldover one million in less than three years of introduction is the acidtest of the desparate need for mobile inputs.

[0021] The E-Board (Objects and Advantages):

[0022] “E-Board” is a full features pocket portable Data Input Board(DIB), for MCCs.

[0023] Since nearly all versions of said DIB are “keyless”, it isreferred to as “E-Board”.

[0024] This Description teaches how to make a DIB, called E-Board that:

[0025] Can have almost all the features of a desk keyboard, and evenmore, such as:

[0026] well spaced and large character Nodes (replacing keys)

[0027] sufficient number of characters

[0028] low actaution force or touch sensitive Nodes, hence fast and funto use

[0029] simultaneous multi-fingers, one or two hands operation

[0030] Yet it:

[0031] can fit into a small pocket, even with an MCC (in the samepocket)

[0032] adds no or negligible weight and/or volume to MCC

[0033] is operable, in hand, on the arm, belt, necklace, desk, etc

[0034] can harbor stylus and scroll, freeing space for screen, memory,processor, etc.

[0035] In addition, E-Board aims to achieve several other improvementsin prior art.

[0036] Many objectives and advantages of E-Board will become apparentfrom the drawings, Summary, Specification, etc.

[0037] For example introducing:

[0038] credit card size but fully functional E-Boards

[0039] a type of transparent E-Board that covers all the screen

[0040] a better way of allocating Nodes to characters

[0041] ways of folding a circuit, more acutely than possible before,without damage

[0042] a thin, tiny, one finger mouse

[0043] marking techniques for faster locating of almost 2 dimentionalNodes

[0044] alternative power sources for E-Board, s.a.photocell, heat cell,thin batteries

[0045] a foldable and/or pocket portable photocell power source for MCCs

[0046] contourable elastomer circuit boards and E-Board

[0047] many other techniques, devices, improvements, etc. as will beseen

[0048] The main and the more general objective is to combine followingobjectives:

[0049] E-Board should be big to have large, well spaced, full set ofcharacters.

[0050] Yet E-Board must be small and light to be pocket portable andhand held.

[0051] Hence for E-Board creation, a technical paradox needs to besolved.

[0052] Claimability (Novelty, Inventiveness, Utility)

[0053] E-Board solves a technical contradiction, being small physicallybut big functionally.

[0054] E-Board is constructed not by one innovation, but by combinationsof many.

[0055] Most Techniques/Devices described here are claimable in manyways, such as:

[0056] on their own right, in isolation from others

[0057] in combination with others

[0058] for general uses beyond E-Board

[0059] E-Board, as a package, and its variations enjoying:

[0060] Novelty—not available in prior art

[0061] Unobviuosness—as hundreds of industry-wide attempts have failedto make one

[0062] Usefulness—as thousands of articles in all media point to needfor such a tool

[0063] Writing Style of this Description:

[0064] To make an E-board, many techniques are developed.

[0065] Many of such techniques are different permutations of varioustechniques.

[0066] The writing style has to be somewhat unconventional to cater tosuch multi-options.

[0067] Key words are either Quotation Marked or Capitalized, to standout.

[0068] Acronyms are created on one occasion that a phrase is used, to beused elsewhere.

[0069] An acronym is formed from first (usually capitalized) letters ofwords in a clause.

[0070] Some deviation from grammar and some coined words are used forsimplicity.

[0071] Whenever a variety of techniques or options are offered, itusually means any of the offered options, unless some other meaning isobvious from the wording.

[0072] Many of techniques or devices that are used here are notdetailed, as they are known to a person skilled in the art.

[0073] Only their relevant key properties related to this applicationare mentioned.

[0074] This Description often uses “logical combinations of two or moretechniques”.

[0075] There may be a very large number of possible combinations of suchtechniques.

[0076] But some of those possible combinations can be technicallyinvalid or nonsensical.

[0077] “Logical” are combinations that make technical sense to a personskilled in the art.

[0078] “Logical” excludes technically incompatible combinations, butincludes viable ones.

[0079] This was done not to have to repeat every possible combination.

[0080] Many areas of the prior art had to be improved, and many new artshad to be developed to tackle all the objective, and since the E-Boardhas many components and inherent techniques, all of which needed to bemodified or created in various forms.

[0081] Therefore, contrary to applicants wishes, the Description isunavoidably LONG.

SUMMARY OF THE DESCRIPTION

[0082] This Description is to teach a person skilled in the art how tomake the E-Board.

[0083] “E-Board”, a Little Big “Data Input Board” is unattainable inprior art.

[0084] Making of E-Board requires a multiple of “challenges”, eachtackled in many ways. Platforms from which prior keyboards are made mastundergo considerable change.

[0085] Those changes are not just in one step of construction, butalmost in every step.

[0086] Here is a summary of what different sections teach towards makingan E-Board:

[0087] A—using the right Technology or Digital Input Plafform

[0088] B—reducing the “thickness” of E-Board, also its volume, bulk andweight

[0089] C—reducing the surface area, without reducing utility

[0090] D—increasing number, size and distances of keys, yet preservingportability

[0091] E—multi Pad E-Boards, which Pads can fold or be detached forpocket transport

[0092] F—making E-Board touch sensitive

[0093] G—making E-Board faster, in particular by marking larger targetsfor fingers

[0094] H—more efficient distribution of characters

[0095] I—making E-Board Structurally Self Suporting or sturdy for standalone operation

[0096] E-Board can be made by logical combinations of Techniquesintroduced here.

[0097] Some of those combinations make better E-Boards, for certainusess than others.

[0098] Other sections of the Description teaches various techniques,devices, parts etc. It elaborates some items or ideas, and explainsother features of importance to E-Board, such as:

[0099] Alternative power sources such as photocell and heat cells

[0100] Elastomer printed circuit boards

[0101] Contourable E-Board

[0102] Transparent E-Board covering most of the screen

[0103] Micro size but functional, fast and fun E-Board

[0104] Techniques to Fold a circuit, tightly and repetitively withoutdamaging it

[0105] One Finger, Thin mouse

[0106] Faster than Qwerty or Dvorak characters arrangement

[0107] Less Known Attempts in Prior Art:

[0108] Prior art does have Foldable Keyboard.

[0109] But none has a Very Thin and Foldable one that has made it toproduction.

[0110] Even Unfoldable, but Ultra Thin keyboard is yet to be produced.

[0111] Some inventors also suggest a “foldable” keyboard, some a thinone.

[0112] But folding a thin circuit board can damage the board and itscircuit.

[0113] They rely on some presumed available mechanism for safe foldingof adjacent parts of a thin circuit board over each other.

[0114] But none, suggests any particular specific technology.

[0115] Technologically, this is a difficult area that has defeated manyattempts to solve it.

[0116] Many other attempts at folding a keyboard have been made.

[0117] All are either folding a thick keyboard which naturally provide asafe radius of fold.

[0118] Or in any case, keep silent about the very difficulttechnological barrier of folding a thin circuit board, safely.

[0119] Thus rendering those silent systems unsuitable to make a foldableE-Board.

[0120] None of those systems are used here as a platform or basis forE-Board.

[0121] All such attempts known to the applicant are far from relevant tobe detailed here.

[0122] This Specification actually develops new techniques for safefolding.

BREIF DESCRIPTION OF DRAWINGS

[0123]FIG. 1 shows a 1-Pad E-Board viewed from above its working surface

[0124]FIG. 2 shows a 2-Pad E-Board viewed from above its working surface

[0125]FIG. 4 shows a 1-Pad E-Board using Walled Nodes

[0126]FIG. 5 shows a general look of a Pointer Node circuit

[0127]FIG. 6 shows a Circuit Curve Limitor

[0128]FIG. 7 shows a Circuit Crease Protector

[0129]FIG. 8 shows an Unfold Limitor

[0130]FIG. 10 shows a 2-Pad E-Board covering an MCC

[0131]FIG. 11 shows some configurations of a 1-Pad Integral E-Board withan MCC

[0132]FIG. 12 shows some configurations of a 2-Pad Integral E-Board withan MCC

[0133]FIG. 13 shows some additional configurations of 1-Pad & 2-PadE-Board with MCC

[0134]FIG. 14 shows MCCs with a multi-Pad E-Board, some Pads are PhotoElectric Cells

[0135]FIG. 15 a preliminary example layout design of character markingsof a 2-Pad E-Board

[0136]FIG. 16 shows 3 different types of CCLs, all on one 2-Pad E-Boardfor brevity

[0137]FIG. 17 shows a 9-Pad Photo Electric Cell power source

[0138]FIG. 18 shows two types of Backfold Stoppers

[0139]FIG. 19 shows a 1-Pad E-Board of Bowl Nodes, viewed from aboveworking surface

[0140]FIG. 21 shows an E-Board working surface area carved into mostlyHexagonal Tritories

[0141]FIG. 22 shows a 1-Pad E-Board carved into some 35 Tritories

[0142]FIG. 23 shows Multi Line and Grid electrical connections from Padto Pad

[0143]FIG. 24 shows Elastomer Fold Strip(s), and Conductive ElastomerConnectors

[0144]FIG. 25 shows a cross section of an abriged Elastomer Keypad

[0145] In this description FIGS. 1, 2, . . . are often referred to byF1, F2, . . .

[0146] Reference Numeral Y on Figure X is denoted by FX-Y such as F1-22

[0147] Description—The E-Board

[0148] Section A—Using the appropriate Digital Input Platform (DIP)

[0149] Two of our broader goals are to make E-Board

[0150] Thin, Light and Small for “pocket portability”

[0151] Multi-Finger and Light Touch Operation to be Fast, Efficient &Fun.

[0152] Above are difficult on their own and technically contradictory toa large extent.

[0153] It helps a lot if the underlying Digital Data Input System canmore easily accommodate all the characteristics and/or modificationsneeded to acheive above and other goals.

[0154] “DIP”, short for Digital Input Platfrom here means the“electromechanical” or “electronic” system or technology, which is usedto make a Data Input Device, by converting operator's finger touch orproximity into electronic codes identified by a computer as characters.

[0155] There are a number of technologies used for various keyboards.

[0156] None have or can achieve all of the required properties ofE-Board.

[0157] But an appropriate DIP, combined with techniques and/or devicesintroduced here can.

[0158] An “appropriate” DIP should ideally have the following features:

[0159] “Thin”, such that an E-Board using it can be made less thanthree, two, preferably less than one or even a fraction of Millimeter mmthick.

[0160] “Light”, weighting less than 50 Grams, preferably less thanTwenty Grams. (for Seventy character Nodes, as large and as well spacedas standard desk keys).

[0161] Touch Sensitive (TS) or Low Actuation Force (LAF), requiringlittle finger pressure. Activation Force (AF) to be close to touchtyping keyboards, arround 50 grams. Higher AF are functional butadversely affect fast or Touch Typing. Typical MCC Thumboards andKeypads need very high AF.

[0162] “Low Power”, not to drain the scarce battery capacity in mobiledevices

[0163] “Modifiable” to acquire above properties, if not its normalcharacteristic.

[0164] Above criteria are necessary but not sufficient to make a goodE-Board.

[0165] DIPs that “depend” on bulky keys or pressure to operate are notgood candidates.

[0166] Following DIPs, are known to the skilled in the field.

[0167] New ones will be known to the skilled when published.

[0168] They meet above criteria, but in different degrees, and suitvarious applications:

[0169] A1-Standard Mechanical keys—with springs is mentioned forcompleteness.

[0170] It is a poor choice, as it is typically not thin nor light, eventhough LAF.

[0171] It requires drastic modifications to approximate our needs.

[0172] But it can be a system to make a less than ideal E-Board usingtechniques herein.

[0173] Its inclusion here is for completeness and encompassing morevariations.

[0174] A2—Optic Fiber Fabric, pressing on which affects the lightpassing through its fibers. Such change, its location and density isregidtersed by a controller.

[0175] A3—Electro-Textile—by Elektex (UK), is a fabric with conductivefibers in x and y directions, which detect the location and amount ofpressure at the point of touch. Earlier versions did not meet any of ourcriteria but it has the potential to become thin, light and perhaps LAF.

[0176] A4—Membrane Keyboards—are Thin and Light, but typically requireAF above 120 grams, hence not Touch Sensitive. But can be made LAF, aswill be shown.

[0177] A5—Any DIP, having or which can be modified to acquire abovecriteria.

[0178] Some exist or are being developed by the applicant, and perhapsothers.

[0179] A6—Any logical combinations of systems in “A”.

[0180] It may make sense to use different DIPs for same E-Board.

[0181] E.g. Elastomer for “characters” and Capacitive for “scroll” key,etc.

[0182] But preferred DIPs, are:

[0183] A7—Touchscreen keyboards—can be made Thin, Light and LAF.

[0184] Their transparency can be utilized for an interesting E-Boardintroduced here.

[0185] They can be programmed to take various markings, and keyarrangements.

[0186] A8—Thin Film Capacitive DIP—Can meet all criteria.

[0187] Capacitive Sensing Circuit can be printed on or embedded in verythin layer(s) of film or board, such that touch or even proximity offinger on certain points on it changes the capacitance at such point,which change is detected by the processor.

[0188] It can be ultra thin, less than a fraction of mm, can betransparent, has no moving parts, And can be programmed to take variousmarkings, characters, arrangements, etc.

[0189] A9—Elastomer Dome Arrays or Elastomer Keypads—

[0190] They are used in many keypads such as dialers.

[0191] Typically do not have any of above criteria, but can be modified,using techniques described herte to meet all criteria, and provide extrabenefits too.

[0192] Their advantages are low powe consumption, operable by a fewsquare centimeters of photo cells, low cost and ability to have tactilefeel

[0193] Section B—Reducing “thickness” of the E-Board

[0194] There are numerous advantages in making the E-Board “thin”, suchas:

[0195] Less volume for mobility, especially pocket portability,particularly alongside MCC

[0196] Possibility of adding it to MCC, and still fit into a pocket

[0197] Easier folding—a thick board is too bulky if folded

[0198] Typically less weight

[0199] To make the E-Board “thin”, we observe that:

[0200] A DIP typically has Keys, Circuit Board, Electronics and OutputConnector.

[0201] Therefore, we eliminate or reduce the thickness of saidcomponents, as follows:

[0202] B1—Dealing with problems of keys

[0203] “Key” is used here as a conventional key on a conventional deskor other keyboard

[0204] Keys have noticeable thickness, volume and weight, each reducingportability.

[0205] Key's fragile mechanical/moving parts, reduce reliability,sturdiness, washability, etc.

[0206] Keys have “height”, making the keyboard thick, hence awkward tofold.

[0207] To reduce thickness attributed to keys, following techniques canbe used:

[0208] B1.1—Using a “Keyless” DIP. Most DIPs in section A, are Keyless.

[0209] Thus “key”s are replaced by “Node”s being the sensitive to touchislands on E-Board. A “Node” is a small area on the E-Board that must betouched, approached or pressed (depending on its Digital Data InputSystem or Plafform, to be activated and cause the E-Board to signal acharacter or funtion to the MCC.

[0210] A Node here will also represent a key if thin keys are used inthe DIP.

[0211] Touching the E-Board outside a Node should not signal anycharacter.

[0212] F1-22 shows a Node by a white circle.

[0213] A “Character Node” is the Node that signals a particular“character” such as “D”.

[0214] B1.2—Eliminating the “Cap” portion of the keys in Elastomerkeyboards.

[0215] Alternatively the “Cap” may be made thin, say less than 0.5 oreven<0.2 mm.

[0216] B1.3—Making Mechanical keys to have minute thickness, weight,volume & bulk.

[0217] Not a good choice for E-Board, but may appeal to conventionaltypsists.

[0218] B2—To reduce the thickness of “electronics”—such as processors,transistors, diodes, resistors, capacitors, etc. following techniquescan be used:

[0219] B2.1—Choosing all components as thin as possible and desirable.Some components can be less than one Millimeter (mm), and others lessthan half or <a tenth of mm.

[0220] B2.2—Compacting some or all of the electronics into one or moreinto chip(s).

[0221] Such chips are called Application Specific Integrated Circuit(F1-24), or ASIC.

[0222] ASICs can be thinner than one, even <half mm.

[0223] B2.3—Placing some or all of the thicker than desired electroniccomponents:

[0224] B2.3.1—Inside the MCC, so that working body of the E-Boardbecomes thinner

[0225] B2.3.2—On a separate chip, which chip can be fixed or detachable

[0226] B2.3.3—On the Output Connector, which may be fixed or detachablefrom E-Board

[0227] B2.3.4—On locations where their thickness has least undesirableeffect

[0228] B2.3.5—On any device that may be used to hold a DetachableE-Board to MCC.

[0229] B2.3.6—Any logical combination of techniques in B2.3

[0230] B2.4—Any logical combination of techniques in “B”

[0231] A Preferred Version for both Integral and Detachable E-Board isB2.3.1.

[0232] A Preferred Version for Detachable E-Boards is B2.2 Combined withB2.3.5.

[0233] B3—To reduce the thickness of Output Connector (F1-26)—we can:

[0234] B3.1—Construct it from thin materials and components, such as“cable band” or “flex”.

[0235] B3.2—Shrink it, by making E-Board Integral and Attached toE-Board

[0236] B4—To reduce the thickness of Circuit Board, techniques in B4 canbe employed. Circuit Board (F1-28), is the board on which a typicallythin “Circuit” is printed.

[0237] It usually underlies the “Keys” and harbors the “OutputConnector”.

[0238] Printed Circuits are thin. But the Board must be made thin.

[0239] Thickness of the “Board” can be reduced by making the “Board”from one or more layers of thin material, such as (B4.1 is preferred):

[0240] B4.1—Thin Films, one group is known as Flex, one type of which isKaptan

[0241] B4.2—Any other suitable thin flexible board

[0242] B4.3—Any suitable thin rigid Printed Circuit Board (PCB), ifflexing is not an issue

[0243] B4.4—Thin sheets of Elastomers or Rubberlike material (such asSilicone or Latex)

[0244] B4.5—Any logical combination of materials in B4

[0245] For example, rigid thin board for most part but flexible film forfolding parts

[0246] B5—Using a suitable DIP that is or lends itself to being madethin, such as those in A.

[0247] B6—Any logical combination of techniques in “B”

[0248] Using the techniques in B it is possible to reduce the thicknessof the Integral E-Board (IEB), to well below two, one or even 0.5 of mm.

[0249] In IEB, Output Connector is shrunk and the “electronics” isinside the attached MCC.

[0250] In Detachable E-Board (DEB), the thickness of working surfaceand/or the Circuit Board, can be reduced to below two, one or even belowone half of mm.

[0251] DEB “electronics” can be reduced to below one mm, or even belowhalf mm thick.

[0252] DEB Output Connector can be made less than one mm or even half mmthick.

[0253] But Output Plug (F1-30) or the tail end of Output Connector whichenters the MCC has to conform in shape and thickness to the MCC InputPort.

[0254] MCC Input Port (Jack) can also be designed to accept very thinOutput Plugs.

[0255] For MCCs that do not accept a thin Output Plug, Output Plug (OP)can be made “detachable” from Output Connector, for transportation.

[0256] Thus the rest of the Output Connector can be made thin.

[0257] Most of above thickness reductions have actually been achieved inprototypes made.

[0258] For Integral E-Boards, thinning of the Working Surface Area onlyis needed.

[0259] Since E-Board adds negligible weight or volume, which is largelyoffset by the reduction in bulk it provides by replacing the MCC cover,it is safe to assume that most MCCs will soon use an Integral E-Board.

[0260] External/Detachable E-Boards will be used for older MCCs withoutan Integral one. Likely all Detatchable ones will be off circulationafter a few years.

[0261] So, thinning of the Working Surface Area of E-Board is of muchmore importance.

[0262] Thinning an E-Board—Example

[0263]FIG. 25 shows the cross section of a typical Elastomer Keypad,also called Elastomer Dome Array. Even though it is not used in verythin form in practice, not intended to be thin and in fact many attemptshave been made to make it very thick, without side effects such asmaking keys wobbly. Thinning is possible as follows:

[0264] Printed Circuit Board (F25-350) can be made of suitable, stiffbut thin material. One such material is called FR4. A layer less than0.25 mm can be strong enough to hold the E-Board for hand held use, notrelying on any desk or MCC support. PCB can also thinner than a fractionof mm, such as flexible circuits, say to make a foldable multi-padE-board. In such case, a supporting layer need be adhered to theUnfolding areas to make it Structurally Self Supporting, as elaboratedlater. Such a layer can be a 0.25 mm thick FR4 or similar.

[0265] Elastomer Pad F25-358, can be less than 0.4 mm and yet befunctional.

[0266] Circuit F25-352 is of micron thichness in a typical PCB.

[0267] Pill or Puck F25-354 can be “conductive ink”, of micronthickness.

[0268] “Travel” or Distance between Pill and Circuit can be as low as0.1 mm.

[0269] But to reduce false activation 0.2 mm is advised.

[0270] Adhesive layer F25-360 is less than 0.1 mm, but not by itselfthickening as it contributes to and is less than “Travel”.

[0271] Cap F25-356 is not essential, as a stiffer choice of KeytopF25-364 can suffice.

[0272] If preffered, Cap can be a stiff thin layer less than 0.2 mmincluding its adhesive.

[0273] Clamp, F25-362 to the rim of the Elastomer Pad which rings aroundPCB to hold the Elastomer Pad in place can be excluded, due to adhesiveF25-360.

[0274] It is needed only for “removable” version of Elastomer Pad layer.

[0275] Conventional Elastomer Dome Arrays (another name for ElastomerKeypads), also have a to layer called “Bezel”, whith holes to let keys,which are typically tall, due to a thick Cap, out and accessible tofingers.

[0276] This Description suggests removeing the Bezel, reducingthickness, weight and cost.

[0277] Conventional Elastomer keypads also have long pins attached totheir undersauface. Pins are for accurate positioning of the ElastomerPad over the PCB.

[0278] This Description removes said pins or makes them shorter than PCBthickness. Instead, carefull adhereing of the Elastomer Pad to the PCBis possible.

[0279] This reduces thickness, somewhat weight and cost.

[0280] Hence an E-Board using Elastomer Pad as its DIP, can be thinnerthan One mm. This is around the thickness of a credit card.

[0281] For “tactile” feel, “Travel” must be more, adding say 0.5 mm, fora total of 1.5 mm.

[0282] Even if many of deireable features are added, below 2 mmthickness is possible.

[0283] For External Elastomer E-Boards, thinning of other componentshave been treated.

[0284] A typical Elastomer Keypad is around 6 mm thick without being“Stand Alone”. Some Stand Alones introduced recently are arround 10 mmthick. One can see the many times thinning improvements by usingsuggestions here.

[0285] Just making a thin input device does not make an E-Board.

[0286] Making an input device small, yet multi finger is a seriouschallenge.

[0287] B.b—Making the E-Board “light”.

[0288] B.b.1—All techniques above to make E-Board thin also make itlight.

[0289] B.b.2—All techniques in “B” above, re-worded by using “light”instead of “thin”, can be applied for making the E-Board “light”.

[0290] There is no need to repeat all reworded version of B.

[0291] Subsection B.b has been devoted to this topic, to avoidunnecessary duplication.

[0292] Same techniques will also reduce volume and/or bulk.

[0293] Techniques to reduce thickness of keys also deal with weight ofkeys.

[0294] Using techniques in “B”, an E-Board having some 70 large, wellspaced Nodes can be made weighing less than Fifty Grams or even lessthan 20 g.

[0295] Section C—Making E-Board Small (yet functionally big)

[0296] Reducing the Working Surface Area (WSA) of E-Board.

[0297] The smaller the surface area, the more pocket portable an E-Boardwill be.

[0298] WSA is made up of Nodes, each having useful and redundant surfaceareas, plus useful or redundant areas between or around Nodes.

[0299] Following techniques can be used to reduce WSA.

[0300] C.1—Techniques to Optimize Node's Surface Shape (NSS):

[0301] C1.1—Round Nodes.

[0302] The joint plane of a finger and the surface it touches, is called“Finger Print” here.

[0303] Finger Print is “round”. Therefore Round Nodes have lessredundant surface area.

[0304] Compared to typical square Nodes (or keys), Round Nodes thatmatch Finger Print:

[0305] have less area

[0306] have less material, bulk, weight, volume,etc.

[0307] can be more tightly arranged

[0308] Round does not necessarily mean circular.

[0309] C1.2—Nodes to resemble in shape the Finger Print of a typicalassociated fingers.

[0310] C1.3—Nodes operated by thumbs, to have a surface, resemblingThumb Print.

[0311] Thumb lands usually sideways on the Node and has an “Oval” print.

[0312] So a preferred Node for Thumb is Oval, with an almost verticalaxis

[0313] C1.4—General Optimization of Node Shapes.

[0314] Mathematical, Computer or Visual techniques can be used to“optimize” Node Shape.

[0315] Hexagon, other Regular or Irregular shapes should be examined.

[0316] Whether or not conventional shapes are optimal should beexamined, not assumed.

[0317] In Optimizing Node shapes, following factors should also beconsidered:

[0318] Each E-Board has its own unique use, dimensions, constraints,etc.

[0319] Nodes need not have similar shapes nor sizes

[0320] “Unintended Node Activation” or UNA to be minimized

[0321] The goal is to reduce overall area of the E-Board, notnecessarily each Node C1.4 is for completeness, in case pre-determinedshapes are not optimal. Special circumstances may warrant usingingenuity to optimize Node shapes. Optimal shape of keys cannot bepredetermined for all uses in this application.

[0322] C1.5—Circular Nodes—

[0323] This is a preferred version, and serves most purposes better thanother techniques.

[0324] They can be arranged side by side most efficiently and easily.

[0325] They are generally the best option, except for Thumb and someother Nodes.

[0326] C1.6—Regular (six sides of equal length) Hexagonal Nodes—

[0327] Another preferred version. It is an optimal shape in the sensethat up to six same size Nodes can surround each Node, and that acollection equally size regular hexagons does not use more total areathan a collection of equal Circular nodes.

[0328] (This assumies diameter of each circle is the same as the spanbetween parallel sides of each regular hexagon.) This is becausecircular Nodes side by side tight collection leaves an emptyquasi-triangular holes between each 3 neighboring circular Nodes. Buttight arrangement of said hexagons does not leave any holes betweenthem.

[0329] C1.7—Any logical combination of techniques in “C1”

[0330] A Preferred Version is “Circular” Nodes for most charactersNodes.

[0331] Thumbs Nodes to be one almost vertical Oval or sum of more Ovalsside by side.

[0332] Nodes such as “enter” to be enlarged using Voids or customdesigned.

[0333] C2—Electronic Reduction of Uninteded Node Activation or UNA.

[0334] This section introduces a technique for reducing or eleiminationgthe need for any margin between nodes and also enabling very small buteasily activated nodes to be compactly placed, yet be operable withuttoo many mistaken activations.

[0335] The tequnique(s) in this section are applicable to all DigitalData Input Devices. Just replace key or another equivalent word forNode, and replace Computer or other Receiving Device for MCC, togeneralize teachings in this section.

[0336] Smaller Nodes arranged “closer” to one another leads to a SmallerWSA.

[0337] All DIPs in section A allow very small Nodes, even less than fewmm in diameter.

[0338] But close arrangement of Nodes results in each touch activatingmore than one.

[0339] Section C offers Three categories of techniques to reduce oreliminate UNA:

[0340] C2—Electronically—Processor and/or Driver to registers only oneof activated Nodes

[0341] C3—Spatially—Optimizing the Distances between Nodes

[0342] C4—Structurally—Barriers for one finger to touch more than oneNode concurrently

[0343] Prior art, by design or default, addresses UNA in mini keyboardsand keypads, via High Activation Force, so that one finger cannot easilytouch many keys.

[0344] If each key needs 150 grams, pressing 4 keys simultaneuouslytakes 600 grams.

[0345] This method reduces speed, fun and duration of a bearable typingsession.

[0346] Reduction and especially elimination of UNA, also increasesspeed, as the operator need not pinpoint the intended Node nor ensureavoiding adjacent Nodes.

[0347] E-Board Processor/Controller and/or Driver or MCC OperatingSystem or the like, can be programmed to only register one of theConcurrently Activated Nodes.

[0348] The software should determine:

[0349] “concurrent”, by some designed criteria, say Nodes activatedwithin a short time

[0350] “order”, say first, and perhaps second, etc activated Node(s)

[0351] “intensity” of activation, such as, “capacitance change”, “areatouched”, “pressure apilied”, “resistance change” or “other” dependingon DIP, or some “logical weighted combination of intensity measures”

[0352] “proximity” of Nodes, such as “adjacent”, “close”,etc

[0353] “duration” that each activated node was constantly touched

[0354] “other” measures, suitable to DIP, use and other factors

[0355] Then an algorithm of designer's choice registers the “IntendedActivated Node”. Variety of algorithms that can be designed arenumerous. One example algorithm is:

[0356] identify all Nodes activated within say 0.1 second of each otheri.e. “concurrent”

[0357] choose those nodes activated with a predetermioned minimum“intensity”

[0358] accept those simultaneous touches that are by design, such asShift+Node

[0359] register the “first” activated node from total of those chosenand those accepted the previous step

[0360] Thus ensuring only one of the Nodes touched is registered foreach finger strike.

[0361] Over time, the oprator becomes accustomed to the algorithm, howbest to operate.

[0362] Using above techniques, more than 60 Nodes, each less than a fewmm in diameter, packed on a surface much smaller than a credit card, canbe operable without UNA.

[0363] Combined with Thinning and LAF techniques herein results in atiny but good E-Board.

[0364] C2 echnique adds no thickness nor weight to E-Board, hence apreferred one.

[0365] C3—Reducing/Eliminating Excesses in Inter Node Gaps

[0366] An Inter Node Gap (ING)(F1-32) is the distance between a point onthe perimeter of a Node and a point on the perimeter of an adjacentNode.

[0367] “Zone”s between Nodes are “insensitive” or “inaccessible” tofinger touch

[0368] A Minimal Inter Node Gap (MING) is the minimum ING between twoadjacent Nodes.

[0369] A Sufficient SMING is a MING, wide enough, to reduce toacceptable level, the occurance of one finger activating adjacent nodescorresponding to said MING.

[0370] One way to reduce UNA is to make MINGs wide enough.

[0371] But wider MING increase overall working surface area (WSA) ofE-Board.

[0372] To reduce WSA and UNA one should Optimize INGs, not justminimize.

[0373] The goal is Reducing or Eliminating any “Excesses” in INGs.

[0374] One technique is to immagine “Node Border Margins” (F1-40) aroundeach Node.

[0375] Then ensure that such imaginary NBMs do not overlap.

[0376] NBMs are parts of Zones necessary to ensure SMINGs.

[0377] Voids, or areas not covered by any NBM on the Zones are not evenneceassry.

[0378] The width of NBMs can be less than half the diameter of a FingerPrint.

[0379] In most DIPs, the center of each Node should be touched foractivation.

[0380] Touchinng the inner periphery of a Node does not usually activateit.

[0381] Therefore, even if MlNGs are slightly less than a Finger Printspan, one finger won't easily touch the centers of two Nodesconcurrently.

[0382] If other techniques introduced here to reduce UNA are employed,

[0383] minimum distance required between adjacent Nodes can be furtherreduced.

[0384] Such other techniques can reduce SMING to negligible or even tozero.

[0385] Perimeter Nodes, not bordering another Node on one (F1-34) ormore sides (F1-36), need a “narrow” Perimeter Margin (F1-38) betweenthem and closest E-Board edge.

[0386] Perimeter Margins less than 2 mm wide are usually enough.

[0387] To minimize the working surface area, one should ensure thatboundaries of adjacent imaginary “Node Border Margins”s (NBMs) are, sofar as possible, “tangential”.

[0388] One should also arrange nodes as compactly as possible, withoutoverlaping NMB.

[0389] A Preferred version is to surround each Node by a 3.5 mm wide NBM(F1-40).

[0390] Then arranges Nodes tightly ensuring that such imaginary NBMsdon't overlap.

[0391] This maintains a minimum Distance of 7 mm between perimeters ofadjacent Nodes.

[0392] If Nodes are 10 mm wide, Node centers will be some 17 mm apart.

[0393] Almost the Distances between centers of conventional keys, butoptimal for pocket.

[0394] Perimeter Margins of a preferred embodiment is 2 mm.

[0395] C4—Reducing the Sufficeint Minimal Inte Node Gaps

[0396] Sufficeint Minimum Inter Node Gaps for “acceptable” UNA can alsobe reduced by following techniques or types of Nodes:

[0397] C4.1—Walled Nodes

[0398] One can reduce Unintended Node Activation (UNA) by placing a“Ring Wall”, continuous (F1-42) or Discontinuous (F1-44), around eachNode.

[0399] Adjacent Nodes, surrounded by Ring Walls are difficult to touchconcurrently.

[0400] Ring Walls can be less than a couple of mm high and less than acouple of mm wide.

[0401] Even Ring Walls a fraction of mm (high) with a fraction of mmwidth are effective.

[0402] Walled Nodes can can be arranged like honey combs, with littlechance of UNA.

[0403] Walls (Grey ring F4-180) should prefereably be:

[0404] Tall enough to prevent one finger touching Nodes on its eithersides

[0405] Short enough not to prevent touching of one Node at a time

[0406] Thick enough, especially at the base, not to fall or bend underrepetitive finger strokes

[0407] Long enough not to bend under finger pressure, and to encircleenough of the Node

[0408] Numerous enough to encircle sufficient section of perimeter ofeach Node

[0409] Rigid enough not to yield to finger pressure.

[0410] Located preferably between adjacent Nodes where said Nodes areclosest

[0411] Preferably mountain shaped, (wider base but sharp top), to easetouching the Node.

[0412] Walls reduce accidental activating of Nodes too, by making itdifficalut for a stray unintended finger to touch a Node.

[0413] Walls can be continuous all around the Node, creating a “cell”.

[0414] Walls forming regular hexagons around each Node, give a “honeycomb” effect.

[0415] Walls can be Discontinuous (F4-182), covering strategic positionsbetween Nodes.

[0416] Elastomer DIP Nodes can be “walled” by stiffening their perimeterwalls (F25-358).

[0417] But Each Node's top skin (F25-364) should be sufficiently softand stretchable).

[0418] Such Nodes will look like “drum”s, which top skin caves downwardto active it.

[0419] But their stiffer walls prevents one finger to cave down morethan one Node top.

[0420] For Membrane, Thin Capacitives, Touchscreens, Elektex, or otherflat surfaced DIP, walls can be planted on their surcace.

[0421] Also an Elastomer Layer as described herein can provideremoveable walls.

[0422] Mechnical Keyboards cannot be walled without overbulking.

[0423] Dimensions in F4 are examples only, but demonstrate a preferredversion.

[0424] Preferred Version: 6 walls each 2 mm thick×3 mm long×2 mm high,each located at tangent points between closely packed 10 mm diametercircular Nodes.

[0425] Over 70 Nodes can be arranged on a rectangular E-Board smallerthan 75×125 mm.

[0426] C4.2—Bowl or Well Nodes

[0427] Are Nodes below the E-Board working surface, such that the fingermust touch the bottom of a “Bowl” or “Well” to activate the Node. It ismore difficult for same finger to reach the bottom of adjacent Bowlsconcurrently. Hence UNA is reduced.

[0428] It is also difficult for an unintended finge to reach the bottomof a Bowl or Well.

[0429] So accidental activations are also reduced.

[0430] Adding a thin layer over the E-Board working surface, with holesto expose the Nodes for touching is one way of achieving this.

[0431] The modified Membrane Keyboard, taught in this Description, withan Elastomer Membrane, can easily have Bowl Nodes, by thickenning thelayer that keeps the Membrane distant from the underlying circuit(distancer or separator).

[0432] Conventional membranes do not stretch. So a thick distncerincreases AF even more.

[0433] F19 shows the arial view of a Pad of Bowl Nodes.

[0434] Inside the bowl is sensitive (F19-190, white circle), except fora narrow rim (F19-192). Bowls should be concave enough or deep enough,so that when each two are placed close to each other, one finger cannottouch the sensitive inside of both simultaneously. Such Bowl Nodes, canbe placed touching rim to rim. A honeycomb appearance.

[0435] A Preferred Version: 10 mm Daimeter Circular Bowl Nodes, 2 mmdeep.

[0436] 70 Nodes can fit on a 75×125 mm E-Board. Dimensions in F19 areexamples only.

[0437] Walls & Bowls add to thickness, but allow more Nodes to be packedon a small area. This can reduce the need for multi-pad E-Board, thusreducing the overall bulk.

[0438] Walls and Bowls also provide feedback when finger touches theWall or Bowl rim.

[0439] C5—Optimal Arrangement of Nodes, over the working surface ofE-Board

[0440] C1 optimises the Nodes shape, in particular suggests CircularNodes for fingers

[0441] C2 teaches how to reduce or eliminate Unintended Node Activationin tiny E-Boards

[0442] C3 minimizes the “excesses” in Inter Node Gaps.

[0443] C4 reduces the Sufficeint Minimal Inter Node Gaps.

[0444] C5 is to minimize sizes of “Voids” (F1-46) or “Redundant AreasBetween Nodes”.

[0445] C5 teaches “optimal” arrangement of Nodes to reduce WorkingSurface Area.

[0446] This can be done on a custom basis depending on size, shape,number of Nodes. Also considering size and shape of E-Board workingsurface.

[0447] Visual, Analytical and Computer optimization techniques can beemployed.

[0448] The technique that works well in most circumstances is asfollows:

[0449] Assume an “imaginary” Node Border Margin” (NBM) (F1-48) aroundeach Node.

[0450] Widths of said NBMs to be half the Sufficeint Minimum Inter NodeGaps.

[0451] Arrange the Nodes, as tightly as possible, ensuring that theirNBMs don't overlap.

[0452] This ensures SMINGs. Yet reduces Voids.

[0453] Final visual or analytical modifications may further increaseoverall utility.

[0454] Equal sized Circular or Regular Hexagon Nodes, surrounded by suchimaginary NBMs, arranged in said manner results in a DiagonalArrangement of Node.

[0455] Each typical Node can be surrounded by and tangents up to sixothers.

[0456] On a rectangular E-Board surface, having vertical/horizontalsides, lines connecting centers of adjacent Circular Nodes forms analmost 60 degrees angle with said sides.

[0457] Centers of any three tangential said Nodes forms an tringle withequal sides.

[0458] Combination of “Circular Nodes” and said “Optimal NodesArrangement” results in

[0459] Substantial reduction in total area of “Voids”

[0460] Substantial increase in number of Nodes that can be placed onE-Board

[0461] Substantial increase in allowable size of Nodes and INGs

[0462] All above without increasing UNA

[0463] Ditto for Regular Hexagonal Nodes or equal size.

[0464] Combination of Circular Nodes & Optimal Nodes Arrangement is notobvious.

[0465] Conventionally, even circular keys are arrangedvertical/horizontal with large Voids Conventional square keys, even ifarranged diagonally, will not reduce Voids.

[0466] A Preferred Version uses equl size Circular Nodes arrangeddiagonally and tightly on a rectangular E-Board. Thumb and/or specialcharacters Nodes are custom designed.

[0467] C6—Some modifications can be made to make a “minority’ of Nodesdifferent.

[0468] Said minority can have different shape, size, ING, etc thanremaining majority.

[0469] Such deviation from general rules can lead to a better E-Board,by making some of more frequently used nodes more easily operable.

[0470] Said modification can have no or minimal overall enlargening ofWorking Surface Area, if done in a way that only reduce Voids, or doneby merging adjacent Nodes.

[0471] C7—Any logical combination of techniques in “C”.

[0472] C.b—Making E-Board Multi Finger Operational (MFO)

[0473] To enable several fingers to operate the E-Board together, thedistances between centers of adjacent Nodes must be prefereably largerthan the width of operator's finger. Keyboards that allow touch typingprovide a range from around 15 mm in compact ones to 19 mm in standarddesk variety.

[0474] This means Nodes that are large and/or far enough, withoutovershooting.

[0475] Nodes Sizes and/or Inter Node Gaps should be modified to makedistance between ceners of adjacent Nodes suitable for MFO, generallybetween 15 to 19 mm.

[0476] If centers of adjacent Nodes are too far, MFO will becompromised, as adjacent fingers can't conveniently aim at adjacentNodes.

[0477] Sectin C can be used to make a functional E-Board smaller than acredit size, with little or no chance of activating the wrong Nodes, butdoes not focus on MFO.

[0478] Section “C.b” teaches making an E-Board small enough, say to bepocket portable, but not necessarily smallest possible, to be capable ofMulti Finger Operation. As the same techniques as in section C aremodified, it is calssified as C.b.

[0479] Section “C” teaches how to reduce Working Surface Area (WSA).

[0480] By analogy,same techniques can be used to enlarge the Nodesand/or the Inter Node Gaps. Hence increase the distances between centersof adjacent Nodes.

[0481] All to be done within a preset, say pocket portable WSA.

[0482] Alternatively, even if Nodes and/or Inter Node Gaps between themneed to be enlarged for MFO:

[0483] optimising the shape for most Nodes (such as Circular)

[0484] optimising the Inter Node Gaps

[0485] optimising the Arrangemnet of Nodes (such as Diagonal forCircular Nodes)

[0486] or/and other techniques taught in C

[0487] will Optimise the Number of Nodes on a preset, say pocketportable WSA.

[0488] Or predetermining the sizes of Nodes and Inter Node Gaps to suitMulti Finger Operation, and applying above optimizations, will result inMinimal Functional WSA.

[0489] D—Enlarging the E-Board and/or Increasing the Nodes

[0490] Ways of making the E-Board, Thin, Light & Small, yet Good Sizewith Optimal Number of Nodes and Multi-Finger Operation, were explainedseparately.

[0491] Such E-Board can fit in a small pocket, even if accompanied by amuch thicker MCC. For even More or Bigger Nodes, techniques are:

[0492] D1—E-Board working surface area can be enlarged, by reducingpocket portability. But being Light & Thin makes it portable in a largepocket, folder or briefcase. E.g. a Detachable E-Board some 8 cm×26 cmor just over a third of a page, with 70 large, well spaced Nodes,thinner than 2 mm overall, carriable inside a file or folder.

[0493] D2—Double Sided E-Board. Placing Nodes on both sides of E-Boardto double WSA. Such an E-Board can be placed between hands for twohands, all fingers operation. An MCC held by a strap or some fingersleaves free fingers to operate it.

[0494] D3—Using the unused back of MCC, for E-Board.

[0495] This increases the total WSA to place more or larger Nodes.

[0496] A special MCC holder can release fingers to operate the back ofMCC.

[0497] Having any additional Node or any Fingers to operate them is veryimportant in MCCs.

[0498] So far we have discussed One Pad E-Boards.

[0499] If a One Pad E-Board is pocket sized, prefereably below 75×130mm, it may be referred to as an E-Pad.

[0500] E—Multi Pad E-Board (F2)

[0501] For More or Bigger Nodes than is possible on a single Pad,E-Board can be divided into two or more Pads (F2-62) or Sub-E-Boards orSEBs.

[0502] Multi-Pad E-Boards can be pocket portable by any of followingtechniques:

[0503] E1—Each Sub-E-Board (SEB) “detachable” for stacking and storage.

[0504] Since each SEB is pocket size and thin, the stack is pocketportable.

[0505] “Thin connectors” should be used for attachment/detachment ofSEBs.

[0506] E2—Some or all SEBs “foldable” over each other, fortransport/storage.

[0507] Making each SEB pocket size, while thin, makes the folded E-Boardpocket portable.

[0508] Special “electro-mechanical” hinges should be used connectingSEBs at fold lines.

[0509] E3—Some or all SEBs “curveable” along their common sides (F10).

[0510] Hence E-Board can wrap around the MCC, and the combination ispocket portable.

[0511] A 2-Pad E-Board (F10-72) can curve at the middle (F10-74) aroundMCC (F10-76).

[0512] E4-Some or all SEBs can be “directly” Attached to or Detachablefrom the MCC.

[0513] Instead of connecting all SEBs to each other, some can connectdirectly to MCC.

[0514] E5—Some or all SEBs “directly” attachable to/detachable from theOutput Connector.

[0515] Two Pads can be detached from each other, but each connected toOC.

[0516] E6—Some or all SEBs attached to and foldable over or curveablearound the MCC.

[0517] E7—Separate Electronics Chip (SEC) to house some or all of thethicker components.

[0518] SECs can be one or more SEBs, detachable, foldable or curveablefor transport.

[0519] E8—Output Connector can be one SEB, Detachable from or curveableover other SEBs.

[0520] E9—A SEB can be placed at the back of MCC

[0521] E10—Any logical combination of techniques in E.

[0522] For example, E-Board can have a Detachable SEC, a CurveableOutput Connector, and two Pads Curving at their junction around MCC,used also as a two sided cover.

[0523] Preferred Version 1:

[0524] Integral E-Board with two SEBs, one attached to the leftside &another to the right side of MCC, both curving over the face as a cover,but open up for use.

[0525] Preferred Version 2 (F2): 2-Pad Detachable E-Board, curveable atPads' common joint. For transport it can wrap around MCC in a pocket orbe unfolded for say a file holder.

[0526] F2 shows a 2-Pad E-Board. The Fold Strip (white rectangle F2-64)has no Nodes. Fold Strip may have Connecting Lines (F2-66 &68)connecting the Pads' circuits. Fold Strip can fold or curve around an“imaginary” Circuit Fold Axis (CFA)-(F2-60). Each separable or foldablesegment of E-Board is called a Sub-E-Board (SEB) here. A SEB can be a“Nodes Pad”, “Output Connector”, “Photo Cell Sheet”, etc.

[0527] SEB is either Detachable from or Foldable/Curveable over anadjacent SEB or MCC.

[0528] Section “F”—Making E-Board Low Activation Force (LAF)

[0529] If pressure needed to activate Nodes, called Activation Force(AF) is high, say above 70 grams, then fast, comfortable or touch typingis difficult or even impossible.

[0530] Fast typing requires light touch, multi finger operating andminimal hand movement. Low Actuation Force (LAF) makes even one fingertyping much faster and easier.

[0531] High AF requires concentration of force in one finger,decommissioning other fingers. This results in exclusive use of thepointing finger and moving of hand from key to key. That is why cellphone keypads must be dialed slowly by one finger (OK for dialing).

[0532] It makes E-mailing, Word-processing and Computing very slow andtiring.

[0533] Onr reason High AF slows typing is that it takes longer to exertpressure on each Node than mere touching. LAF is much faster even ifjust one finger is used.

[0534] Another reason Hight AF slows typing is that several fingerscan't operate together. Typically, Keypads or Mini keyboards use onefinger or two thumbs, one at a time.

[0535] High AF makes typing tiring, causing keyboard avoidance and shorttyping sessions.

[0536] To make E-Board Low Actuation Force (LAF) or Touch Sensitive(TS), we use:

[0537] F1—DIP which is inherently TS or LAF, from section A, such asCapacitives.

[0538] F2—Choosing the TS or LAF from the range available in the chosenDIP.

[0539] E.g. Elastomer Keypads have a wide range of AF from 10 gr to 300gr to choose.

[0540] F3—Making Physical and/or Electrical modifications to DIP toachieve LAF, s.a.:

[0541] 3.1—Making their electronic measurement system sensitive to LAF

[0542] 3.2—Reducing distances which need to be closed by pressure foractivation

[0543] 3.3—Using materials sensitive to LAF in their construction

[0544] 3.4—Other measures, depending on their technology

[0545] 3.5—Any logical combination of techniques in F3

[0546] E.g. Techniques to make Touchscreens LAF are known to theskilled.

[0547] F4—Using an Elastomer Sheet as the “membrane” in MembraneKeyboards. Conventional membrane switches using a non-stretch membraneare High AF. Reducing the key (downward) travel is one current method ofreducing AF.

[0548] But it makes the key vulnerable to false registration. Anothermethod is to make larger keys, which enlarges the keyboard counteringour attempts to shrink it.

[0549] Neither methods reduce AF to our desired level reliably andfaultlessly.

[0550] This Description introduces the use of a membrane made of an“elastomer” such as Silicone, Latex, Urethane, Rubber or otherRubberlike material.

[0551] Since elastomers stretch, little force is needed to cave themdown to activate the key. Since elastomers retract (or retretch),release or deactivation is automatic.

[0552] Making the underside of the elastomer sheet conductive ispossible using conductive ink, conductive paint, conductive particledoping, metal foil or other known methods.

[0553] F5—Any logical combination of techniques in F

[0554] G—Making E-Board Faster

[0555] Some of factors that contribute to faster typing are:

[0556] 1—Reduced chance of unintended Unintended Node Activation.

[0557] Thus the operator does not have to pinpoint the intended Node.

[0558] Also, less corrections of wrongly activated Nodes are necessary.

[0559] This speeds typing in one finger, two thumbs or multi-fingeroperation.

[0560] 2—Low Activation Force, which increases speed even for one fingeror two thumb operation and is important for multi finger operation.

[0561] 3—Multi Finger Operation.

[0562] 4—Efficeint Allocation of Characters and Funtions to Nodes

[0563] Above factors have been treated elsewhere in this Description.

[0564] G5—Ease of Locating Nodes

[0565] This is of particular importance in keyless, almost 2 dimentionalNodes of E-Board.

[0566] If Nodes look like isolated islands over a plain WSA, time islost for each finger ensuring to land on the center of the intendedNode.

[0567] This Description introduces a solution as follows.

[0568] G5.1—Divide WSA amongst Nodes, with visible, prefereably raised(3-D) lines.

[0569] Said Lines preferably drawn through the center line of Inter NodeGaps.

[0570] Said lines specifiying the boundary of each Node's “Teritory”(F22-304).

[0571] Thus fingers can locate “Tritory”s instead of pinpointing theNodes within.

[0572] Yet, it is not very likely to hit a Tritory without activatingthe Node inside it.

[0573] Lines that are not through the center of Inter Node Gaps can alsobe drawn, to manipulate the shape, size, etc. of some Treitories, forany desired result. Such Teritorila boder lines don't change Inter NodeGaps or position of Nodes.

[0574] But placing Nodes off the center of a Teritory may reduce chanceof hiting it when finger aims for the Teritory.

[0575] F22-306 shows one Teritory. F22-308 shows the active part or Nodeof a Teritory.

[0576] F22 shows 35 Teritories, each as large as desktop keyboard key,some like “enter” larger than most, all in less than a pocket PDA sizeof 75×125 mm.

[0577] G5.2—Make Nodes as larger, within bounds dictated buy neededInter Node Gaps.

[0578] This increases the chance that a finger touching a Tritory toactivate its Node.

[0579] G5.3—Divide the “Voids”, between and merge them visually intoadjacent Tritories.

[0580] Voids are redundant areas between Nodes excessive to needed InterNode Gaps.

[0581] If Voids remain visible as separate islands on WSA, operatorseyes wastes time screening them out before identifying the right Nodes.

[0582] G5.4—Allocate more Voids to more frequently used Nodes, s.a.“enter” (F22-302)

[0583] G5.5—Place Thumb operated Nodes, such as “space” on the LowestRow on WSA.

[0584] This prevents Thumb activating lower Nodes, as it would dootherwise.

[0585] Thumb Node on Lowest Corner reduces its chance of hitting otherNodes (F22-300)

[0586] As it is difficult to direct the Thumb to any Node, special careis needed.

[0587] G5.6—Allocate more than one Teritory to cruicial symbols s.a.SPACE (F22-300)

[0588] G5.7—Prefereably disguse Nodes, so that eyes don't search forthem.

[0589] Eyes better search for as little as possible, in this caseTeritories and Markings.

[0590] G5.8—Logical combinations of Techniques in G.5

[0591] Note that not all need to be done, but doing any step should addto speed

[0592] One preferred version for Circular or Hexagonal Nodes is aHegxagonal Teritory for each Node. Such Hexagons also encompass Voids.(FIG. 21)

[0593] Another preferred version for circular Nodes is as in FIG. 22.

[0594] G6—Logical combinations of Techniques in G.

[0595] H—Efficient Allocation of Characters & Functions to Nodes

[0596] The most popular English keyset is called QWERTY. But itsefficency is in doubt.

[0597] Dvorak tried to increase efficiency by allocating the most usedcharacters to Home Row.

[0598] This Description introduces another arrangement to increaseefficiency, as follows:

[0599] 1—Imagine placing a typical hand over an E-Board or Keyboard, tofind the most convenient Node or Key for each Finger, referred to as“Home Nodes”.

[0600] Home Nodes are likely not all on Home Row, as finger tips form anarc, not a row. Research and experimentation can determine the mostpopular Home Nodes.

[0601] 2—Determine the Most Active Fingers, by research, analysis andexperimentation. Alternatively assume their order by how close they areto Thumb.

[0602] 3—Determine the relative use of characters and or functions or ingeneral “symbols”, by research, analysis and experimentation.

[0603] This may be different for different uses. For example, PDAs willmostly use the E-Board for E-Mailing, which uses a different phrasesthan a financial MCC.

[0604] 4—Allocate Most Used Symbols to Most Active Fingers' Home Nodesin logical order.

[0605] 5—Allocate remaining Symbols to Nodes that can be reached mosteasily from Home Nodes, applying, having priority for more activefingers home Nodes

[0606] 6—Allocate remaining less used symbols to double touch set, suchas Shift+Character

[0607] In effect improve on Dvorak by distinguishing Home Nodes fromHome Row.

[0608] I—Making E-Board Structurally Self Supporitng (SSS)

[0609] Elastomer Dome Arrays, Membranes, Touchscreens, Thin FilmCapacitivess and the like DIPs are meant to rest on their receivingdevice for structural support.

[0610] In Typical uses Touchscreens are adhered to the screen. MembranesSwitches are adhered to and rest on the usually industrial controldevice that uses them. Elastomers typically rest on the body of say theremote control use them, etc.

[0611] Electromechanical Keyboards, rest on the body of laptops or adesk.

[0612] Electex Keyboard also has to rest on a desk or other support.

[0613] Applicant does not know any “stand alone” Membrane, Elastomer,Touchscreen or Thin Film Capacitive keyboard.

[0614] Elektex and Electromechnical keyboards are stand alone but relyon desk.

[0615] E-Board, though connected to MCC, electrtonically and physically,is not meant to rely on the MCC to prevent it from bending or breaking,under finger strikes.

[0616] Besides, E-Board, unlike the input devices that are attached tothe receiving device, cannot rely on the protection of the receivingdevice or its carry boxes for protection needed when not in use say inpocket.

[0617] In fact, E-Board should be strong enough to protect the MCC ifused as a cover. Without desk support, E-Board is either held in hand orby some kind of holder.

[0618] It should be strong enough to withstand holding force of anyholder or suspender.

[0619] With desk support, E-Board should be sturdy enough to be standalone.

[0620] Also, its electronics should be protected from abrasion fromdesk, pocket, etc.

[0621] To make E-Board structurally self supporting, followingtechniques are proposed.

[0622] One is to make its underlying material sturdy enough.

[0623] Printed Circuit Board of Elastomer Keypads (a.k.a. Elastomer DomeArray), PCB of Membrane KeyBoard, Layer(s) of the Touchscreen or theFilm in Thin Film

[0624] Capacitive can all be chosen stronger, even if slightly thicker.

[0625] For example a 0.25 mm thick FR4 as PCB an be good enough.

[0626] Electronics or circuit lines should not be exposed on the back ofE-Board.

[0627] If they have to be there, a thin protective layer should coverthem.

[0628] Another technique is to adhere a thin but sturdy pad under theE-Board.

[0629] Such a pad makes E-Board self holding and protect any exposedelectronics under it.

[0630] For example, a quarter mm thick FR4 layer can be strong enoughfor the job.

[0631] There is no shortage of alternative material, and better oneswill be invented.

[0632] Thus, a touchscreen which is conventionally attached to MCCscreen for support can become an E-Board that is like a flip cover onMCC side or detatched from MCC.

[0633] As an example, a rollable Elektex keyboard that relies on deskfor operation, if such a pad is added, can be used in hand. But it mustalso undergo other techniques in this Description to make an E-Board. Itshould become much thinner, lighter, touch sensitive, smaller (but withsufficient numbe of well spaced Nodes) etc.

[0634] J—Some E-Board Examples:

[0635] J.1—One Preferred Version (F1), uses Capacitive DIP,has 35 Nodes,each 10 mm diameter circles, arranged on a Rectangular E-Board surfacesmaller than 75×25 mm. Minimum distance between perimeters of adjacentNodes is 7 mm.

[0636] Hence little chance that a finger aimed at center of a Node hitsthe center of another.

[0637] In most DIPs, area close to center of Node must be touched foractivation.

[0638] Touching periphery of a Node does not usually activate it.

[0639] So if finger touches peripheries of adjacent Nodes UNA will notnecessarily happen.

[0640] In above Version, distance between centers of adjacent Nodes is17 mm.

[0641] Thus ample distance between operating fingers, and little chanceof Finger Jamming. Allocation of characters to Nodes can be as desired,such as;

[0642] 35 Nodes=26 ‘alphabets +“space”, “enter”, “delete”, “back”,“shift”, “control”, etc.

[0643] For numerals and other characters, “shift” (say), can add another35 symbols.

[0644] For even more characters, “alt” (say) can add another 35.

[0645] One hand operation of a 35 Nodes Pad means say 8 Nodes perfinger, 3 for Thumb. For two hands (desk) operation, a two Pad 70characters E-Board can be used

[0646] J.2—Honey Comb E-Board—A Preferred Version

[0647] Nodes are all regular Hexagon, 9 mm from side to side, mostcompactly placed together, with no Inter Node Gaps between them. So thedistance between centers of alternate Nodes is 18 mm, which is ideal forMulti Finger Operation.

[0648] Operator can choose Home Nodes to be 18 mm apart to avoid FingerJamming.

[0649] It uses the “electronic technique” introduced for eliminatingUnintended Node Activation. Each Node is surronded by up to Six adjacentNodes, as visual Inter Node Gaps.

[0650] Due to above UNA avoidance, “insensitive” Inter Node Gaps are notneeded.

[0651] 70 Nodes can be placed on 99 mm X66 mm area, slightly larger thana credit card.

[0652] One hand cannot conveniently handle more than 35 Nodes.

[0653] Over 35 Nodes can be placed on less than a credit card size of54×86 mm.

[0654] Using other techniques introduced here it can also be as thin &light as a credit card. It can be Touch Sensitive and Multi FingerOperation for Touch Typing.

[0655] J.3—On Screen E-Board.

[0656] This description teaches making a Small Multi Finger Operation.One version follows.

[0657] We use Transparent (Touchscreen or other) DIP to make theE-Board.

[0658] We use Transparent color(s) such as pale Yellow or Grey dye,paint, layer or doping to mark for Nodes and/or Teritories andcharacters.

[0659] When such E-Board is placed over an MCC screen, the screen isvisible.

[0660] Transparent Markings can also be provided by software, to becleared when not in use.

[0661] Such E-Board Working Surface Area can be as large as, the MCCscreen or less. Such an E-Board can be removeable, when not in use.

[0662] Hence a well sized E-board which does not prevent function of thescreen is created.

[0663] Most MCCs and Notepads have a Touchscreen covering much or all oftheir screen.

[0664] Many have a tiny keypad programmed onto their Touchscreen.

[0665] But such keypads are tiny and/or steal from the scarce screen.

[0666] Transparent Markings, enables the Touchscreen keypad to be muchlarger.

[0667] Not stealing from the screen is an advantage for Notepads butcrucial for MCCs.

[0668] This also enables a bigger screen for MCC, as the area allocatedto tiny touchscreen keypad is not needed.

[0669] Also, adding an E-Board eliminates the need for all the other onscreen input devices such as Handwriting Pad. It can eliminate the needfor some off screen input devices, whose function can be delegated toE-Board, which also reduce the size of screen.

[0670] Thus the screen can be almost as large as all of the top of anMCC.

[0671] This in turn provides more area for the Transparent E-Boardmaking it even better.

[0672] While conventional tiny touchscreen keypad is of little use, theTouchscreen E-Board described here can be a proper touch typing inputdevice.

[0673] J.4—Multi Marked E-Board

[0674] This Description teaches how to pack a good number of Nodes intoa credit card size or even smaller surface, yet prevent Unintended NodeActivation.

[0675] It also teaches making a pocket size surface, Multi FingerOperation for Touch Typing. It teaches using different Digital InputPlafforms, such as Touchscreen for E-Board.

[0676] Now it teaches use of Touchscreen or, Capcitive Transparent ThinFilm, or any other programmable DIP to make a Multi Screen E-Board.

[0677] Software in the E-Board Driver and/or Firmware in itsController/Processor or Operating Software, etc. can be programmed toprovide various screens and marking for the E-Board, such as:

[0678] various size WSA, say 20×30 mm to 75×125 mm

[0679] various alphabets and functions s.a. English, Greek, etc.

[0680] various Node arrangements, s.a. Qwerty, Dvorak, etc.

[0681] various Node sizes within any specific WSA

[0682] various other variations, as designers can imagine

[0683] various logical combinations of above factors.

[0684] Such an E-Board can be 1-Pad, Multi-Pad, Integral to MCC,Detatchable, External, etc.

[0685] Some Preferred Embodiment(s):

[0686] Uses one of Preferred DIPs from section A, prefereably ElastomerDome Array.

[0687] Each Pad has 35 Nodes of 10 mm Dia. arranged diagonally, 17 mmcenter to center.

[0688] Thumb Nodes and special character Nodes are designed for optimalshape for use

[0689] Integral E-Board has one or two Pads, attached to MCC side(s),and fold over it. One or two mainly Photo Cell SEBs (PC-SEB) attach tounused sides of MCC. PC-SEBs are also foldable over the face of the MCCfor transport and protection.

[0690] Detachable E-Board (DEB) has an attached Output Connector thatcan fold over it. A Circuit Curve Limitor protects circuitry at thefoldable areas.

[0691] Said Output Connector has a Detachable Output Plug for eachdifferent MCC.

[0692] DEB is “suspended” to one of MCC sides, and can fold over the MCCas cover. DEB can also be strapped to the arm or placed on desk foroperation.

[0693] Two-Pad DEB, has 2 single Pads, attached to each other alongtheir shorter sides. It is “curveable” around the top or bottom of MCCfor transport.

[0694] Lift Function or Node:

[0695] One pad E-Boards and/or E-Pads are primarily activated by samehand.

[0696] So holding the Shift Node while operating another reduces thefree fingers.

[0697] A solution is to provide another type of Function, which we callLift Function.

[0698] It can generate a different characters function functiosn whenactivated before or after a node, than the primary character or functionallocated to said Node.

[0699] But it need not be held or touched continuously from before toafter the other Node is activated. So the finger activating it is setfree to active next Node.

[0700] Providing Node Activation Feedback:

[0701] Most Digital Input Platforms in section A provide no Tactilefeed-back.

[0702] Compensating techniques are:

[0703] 1—Auditory means, such as “beep” to confirm activation

[0704] 2—Coarse markers on or around each Node that would be sensed byskin touch

[0705] 3—An optional and detachable thin Elastomer Tactile Layer.

[0706] Elastomer Tactile Layer (ETL):

[0707] ETL is like the Elastomer part of Elastomer Dome Aray to beplaced over E-Board. Thus LAF yet Tactle Feel is provided in the sameway Elastomer Keypads do.

[0708] LAF can also prevent unintended touch for Touch Sensitive DIPs ora distance for Proximity Sensing DIPs, allowing fingers to rest on HomeNodes.

[0709] ETL can have calmps ringed around it to hold it on the E-Board.

[0710] Elasticity allows the operator to remove it when not needed.

[0711] Top of each elastomer key can be:

[0712] “conductive” if needed for E-Board's underlying DIP

[0713] “open” if needed for DIP that require direct finger touch on theNode

[0714] Interchangeable Node Markings.

[0715] Elastomer Tactile Layer can be changed for different Charactersets, say Englisht to Greek, and for different Node arrangements such asQwerty to Dvorak.

[0716] A suitably programmed Driver can make the correspondingElectronic changes too.

[0717] Without tactile, an ultrathin, even below one tenth of mm,elastomer layer is sufficient.

[0718] Certain Capacitves and Touchscreens can be programmed to showdifferent Node Markings, without the need for such layer.

[0719] Home Nodes Finger Rests:

[0720] Many Touch Typists rest their fingers on Home Nodes, which causesunintended activation if DIP is Proximity or Touch Sensitive, such as inCapacitive systems.

[0721] To prevent this, one method is using an Elastomer Tactile Layer,explained.

[0722] But ETL increases thickness, which may not be desireable.

[0723] One technique is a suitable E-Board Driver Software or E-BoardController Firmware. The systems algorithm ignores continuous touch offinger on any Node.

[0724] Many different algorithms can be designed to suit variouscircumstances.

[0725] Making Detachable E-Board (DEB), “specific” to a MCC

[0726] Various options to make DEB to suit a specific MCC, are “making”

[0727] 1—Circuit Board Electronics & Output Connector, all “specific” toa MCC

[0728] 2—“Universal” Circuit Board but “specific” detachable OutputConnector & Electronics

[0729] 3—“Universal”Circuit Board & Electronics but “specific” OutputConnector(OC)

[0730] 4—“Universal”Circuit Board, Electronics & OC but “specific”detachable Output Plug. “Output plug” is the tail end of the OutputConnector, that enters the MCC Input Port

[0731] Wireless Connection to the MCC:

[0732] The E-Board can be wirelessly connected to MCC if it has it ownpower supply.

[0733] Thus no need for a physicall output connector.

[0734] One way of providing Power is a small battry, prefereably placedon a Holding device that may be used to hold the E-Board to MCC.

[0735] Another is to attach a Thin, Repalcible or Rechargible,preferably Removable battery. Very thin batteries exist, some usingpolymer films thinner than a fraction of mm.

[0736] Another way is to place a Photo Cell Layer, prefereablyremoveable, occupying areas that do not adversely affect E-Board'sfunction.

[0737] Detachable E-Board (DEB)—Operational Locations

[0738] DEB can be made to suit various operating situations, such as:

[0739] On the desk

[0740] Attached to belt, using a belt loop and long or wireless OutputConnector (OC)

[0741] Suspended from the neck, using a necklace and long or wireless OC

[0742] Attached to clothes, using Pins, Velcro, Sewing, etc., pluslong/wireless OC

[0743] Attached to the sleeve close to the MCC

[0744] Strapped by Velcro or Elastic Straps, to arm, wrist or hand closeto MCC

[0745] Attached to or Suspended from the MCC using suitable “suspenders”

[0746] Opposite the tips of fingers, held by a suitable “DEB Holder”

[0747] Backside of the MCC

[0748] Other positions

[0749] E-Board Doubling as MCC Cover

[0750] E-Board can double as an MCC cover, (F10) eliminating the needfor a cover.

[0751] E-Board can be made lighter and thinner than a typical MCC cover.

[0752] Thus reducing overall weight and/or volume of the combinedMCC+E-Board.

[0753] An E-Pad, hinged to one side of an MCC can pivot to cover saidMCC screen.

[0754] It can also pivot in the diffent direction to be operated.

[0755] A Suitable hinge, well know to the skilled, can keep it firmly inoperational position without letting it fold too far back.

[0756] Hand Writing Pad (HWP) on E-Board

[0757] E-Board should eliminate the need for a HWP, but if needed, HWPcan be placed over the E-Board to save the working surface of the MCCfor a larger screen.

[0758] HWP can also be a Sub-E-Board, connected to either E-Board or MCCby flexible or foldable cables, using our relevant techniques, such asCircuit Curve Limitors, to be folded or disconnected for transport andunfolded or connected for use.

[0759] Such a segregated HWP can be made much larger than a HWP on MCCor E-Board. It can be as large as one pocket size Pad, not limited toscarce space.

[0760] E-Board located HWP frees space for more Screen, Memory,Processor, Battery, etc. Similarly, an E-Board can harbour a Touch Pador Mouse Pad, prefereably a Thin Film Capacitive Touch Pad. This reducesor eliminates the need for the Touchscreen used as a layer on top of MCCscreens, hence reducing the weight, thickness and perhaps price of anMCC.

[0761] E-Baord can also have all functions such as Scroll, whichtypically occupy part of an MCC working surface, allowing a much largerscreen.

[0762] E-Board/MCC Configurations

[0763] Integral E-Board (IEB) can be attached to MCC in numerouslocations.

[0764] Detachable E-Board (DEB) has more freedom of location alongsideMCC.

[0765] All IEB configurations can be achieved for DEB using suitable“suspenders” Suspenders can keep DEB alongside MCC in locations that areawkward for IEB. DEB can also be “unsuspended” from MCC, say “strapped”to the operators arm. DEB can also be “separated” from MCC, whileoperated on a desk.

[0766] FIGS. 10,11,12,13,14 show example E-Board/MCC configurations. Ineach Fig.: —diagonally crossed part denotes the screen or the MCC

[0767] blank part(s) denote E-Board Pad(s)

[0768] vertical/horizontal crossed parts denote Photo Cell Pads

[0769] 4—parallel lines denote “acute” Fold Strips

[0770] 5—parallel lined denote “curving” Fold Strips

[0771] an antenna illustrates that MCC can be a Cell Phone

[0772]FIG. 10 shows a 2-Pad E-Board curving around and acting also asMCC cover

[0773]FIG. 11 shows some 1-Pad Integral E-Board configurations

[0774]FIG. 12 shows some typical 2-Pad Integral E-Board configurations

[0775]FIG. 13a—a1—Pad Detached E-Board—Say on a desk

[0776]FIGS. 13b—a1—Pad Detachable E-Board suspended from MCC

[0777]FIGS. 13c-a2—Pad Detachable E-Board suspended from MCC

[0778] Each Pad is connected to Output Connector independent of theother Pad

[0779] Pads don't have to be connected to each other mechanically norelectrically

[0780]FIG. 13d—a2—Pad Detached E-Board

[0781] Say a DEB strapped to right arm, operated by left hand. CellPhone held by right hand.

[0782]FIG. 14a—a 4-Pad Integral E-Board. 2 Pads are Photo Cells

[0783] All pads fold over the MCC in turn, for transport.

[0784]FIGS. 14b—a 2+6-Pad Integral E-Board. 2 Node Pads+6 Photo CellPads (PCP)

[0785] In F14, for pocket transport, the following folding sequence canbe performed:

[0786] two Node Pads fold over the front of MCC

[0787] central upper PCP folds over the front of MCC

[0788] right upper PCP curves around the right side of MCC and foldsover MCC's back

[0789] left upper PCP curves around the MCC's left side and folds overMCC's back

[0790] central lower PCP folds over the front of MCC

[0791] right lower PCP curves around MCC's right side and folds overMCC's back

[0792] left lower PCP curves around MCC's left side and folds over MCC'sback

[0793] For operation, MCC and E-Board can rest on desk or lap.

[0794] For hand held operation, a strap at the back of the MCC can holdthe MCC to the hand.

[0795] Pointer or Cursur Function:

[0796] PF (F5) is introduced in this Description as an alternative to“mouse”.

[0797] A desk operated mouse is not suitable for MCC, especially on themove.

[0798] A “ball mouse” is too thick for MCC.

[0799] Mouse Pads used for notebooks occupy too much of scarce area onMCC or E-Board. “Stylus” requires a costly “touchscreen” imposed onMCC's LCD plus a pen to carry.

[0800] PF resolves all above, as one compund Node on the E-Board or MCC.

[0801] Replacing a costly touchscreen and stylus, mouse ball or mousepad, by just one Node, saves scarce space, cost, complexity, weight,bulk, etc.

[0802] PF is a “Compound Node” (F5-80) having 4 Sub Nodes (SN) (F5-82).

[0803] One finger should be able to roll over all SNs, with minimallateral movement.

[0804] Activating one SN should not automatically activate other SNs.

[0805] Theoretically Three or more SNs can do the job, but four iseasier or more intuitive. The E-Board or PF specific Controller (or itsequivalent), measure the “intensity” of touch in all SNs, and determineposition of the Cursur, by an algorithm.

[0806] Such algorithm can have variations determined by designers.

[0807] One algorithm can assume an Algebraic “Vector” for each SN, which“magnitude” or “absolute value” is determined by intensity of touch atsaid SN, and which “direction” resembles the approximate direction ofsaid SN.

[0808] Thus Algberaic sum of said Vectors can determine the Location ofCursur.

[0809] As an example, one SN measures Positive Y axis, the opposite SNdenotes the Negative Y axis. So the Y coordinate is determined fromalgebraic sum of above. Similarly for the X axis. Hence X-Y coordiatesof the Cursur is determined by relative Intensity of all the Sub-Nodeson the Cursur Node.

[0810] Various measures of “Intensity” are discussed elsewhere in thisDiscription.

[0811] One factor in measuring “Intensity” that can be used in E-Board,but is of particular value for Pointer Node is “duration of activation”.If one Sub-Node is held longer, it can be give a higher “intensityvalue”.

[0812] Rolling of the operators finger on PF changes the pointerlocation.

[0813] Rolling to right, left, up or down drives the pointer on thescreen.

[0814] To make it more intuitive, the Sub-Nodes better represent up,down, left &right.

[0815] When pointer is on the desired point, the operator can press“enter” (say) to confirm. Alternatively, just lifting the finger may beused as confirmation.

[0816] Alternative electronic designs are possible. A good choice is aCapacitive DIPs. SNs can be electronically disconnected bynon-electroconductive region (F5-84). Placing finger over PF affectscapacitance in each SN, proportional to the area of each SN covered bythe finger and also pressure applied to each SN.

[0817] PF's circuit and electronics can be designed, using techniquesknown to the skilled, to measure capacitance in each SN, and translatetheir algebraic sum to the location of pointer on the screen.

[0818] One alternative can measure the electric flow, instead ofcapacitance, between SNs. PF can have a Conductive Center (CC) (F5-86),electronically separated from all SNs. Placing finger on PF affectselectric flow and/or capacitance between the CC and any SN connected toit by finger's conductivity.

[0819] The more a section is covered by finger and the more pressureexerted on a section, the more the flow between CC and that SN.

[0820] The algebraic sums of flows to/from different SNs can betranslated by the processor to the position of the pointer on thescreen.

[0821] If capacitance is measured, PF can be covered by a thinnon-electroconductive layer. Finger proximity can change capacitance incovered sections.

[0822] PF is cheaper and lighter than touchscreen stylus, and saveshaving to carry a stylus.

[0823] A 4-SN Cursur Node can also play the role of and eliminate theneed for a “Scroll”.

[0824] Cursur Node may use a different DIP than the rest of the E-Board.

[0825] Capacitive DIP suits a Cursur Node better, as it it easier tomeasure relative Intensity. So E-Board can be Elastomer Dome Array,while PF is Capacitive.

[0826] Yet both can use the same E-Board physically. Each can haveseparate controller. Preferable E-Board and Pointer Node should sharethe Controller and Driver.

[0827] Scroll Function:

[0828] Conventional Scrolls have 2 keys for up/down plus often 2 keysfor right/left. Said keys are placed together as one scroll key,operated by one finger or thumb. Scroll moves a selector up, down rightor left on the screen, to selected target.

[0829] Scroll Node can be added to E-Board by 1, 2, 3 or 4 closelyplaced Nodes

[0830] By moving the scroll to the E-Board, MCC screen can becomelarger.

[0831] Removing scroll keys from MCC saves scarce allowance of weightand volume that can be allocated to more battery, memory, processor,etc.

[0832] Scroll Node can also use “duration of actgivation of eachSub-Node” as a measure to determine how far and in what direction tomove its screen indicator.

[0833] Circuit Curve Limitor (CCL):

[0834] For E-Board, especially for production considerations, it isbetter that Sub E-Boards have continuous circuits, between various SEBs,in particular between Pads. Continuous Circuits are more powerefficient, can work with lower voltage and amps, are easier and cheaperto produce, and are more reliable.

[0835] When any Flexible Film Circuit Board is to be folded along anaxis, it is important that the curvature of folding does not fall belowa minimum radius, otherwise:

[0836] the circuit inside or on the flexible film will break afterrepetitive folding

[0837] the flexible film will crease, crack and tear, when subjected torepetitive folding

[0838] To solve this problem this Description introduces Circuit CurveLimitor (CCL).

[0839] It is made of an Elastomer (Rubber-Like) material. Its generalshape is as in F6.

[0840] It is adhered to the surface of flexible circuit board, such thatits Imaginary Fold Axis (IFA) shown in F6a-90 substantially covers theCircuit Fold Axis (CFA).

[0841] CCL should preferably cover all of the Fold Strip, and more, butnot over any Node. CCL length or the size of its IFA can be shorter, butshould preferably be same or marginally longer than the length of theFold Strip.

[0842] CCL width can be less but should preferably be equal or more thanFold Strip width.

[0843] CCL can have no Peak nor Valley, (no grooves), just a ThickenerElastomer Band. CCL can have one Peak (F6b-92) or more. It can have orone Valley (F6b-94) or more.

[0844] Number and dimensions of Peaks and Valleys and thickness of thebase (F6b-96) are determined by width of Fold Strip (FS) and requiredminimum Fold Curve Radius. Dimensions in F6 are examples only. F6example covers a 14 mm wide Fold Strip.

[0845] F6c example insures a lower limit of 6 mm as the circuit foldcurve diameter.

[0846] In other words, a CCL less than 2 mm thick designed as describedhere, can In other words, a CCL only 2 mm thick if designed according tothis Description can ensure that the circuit will not fold more acutethan 6 mm diameter of curve at fold.

[0847] CCL prevents the circuit board from folding more acutely than itsown fold radius.

[0848] The grooves make folding easier, and reduce internal stress.

[0849] F6 shows CCL: (a) perspective, (b) unfolded cross section, (c)folded cross section.

[0850] CCL can be used for single and multi pad E-Boards at junction of

[0851] Output Connector and E-Board

[0852] Output Connector and MCC

[0853] Integral E-Board and MCC

[0854] Adjacent Pads, over the Fold Strip

[0855] Any two segments of a circuit board that are folding along afolding junction

[0856] CCL, with or without Grooves, reduces damage to the Circuit andthe Flex-board. It may be adhered to the undersurface of the Flex-boardalong the Fold Strip also.

[0857] Other Types of Circuit Curve Limitors:

[0858] Following CCLs are also mentioned for completeness and potentialutility:

[0859] 1—A Rubberlike Cylindrical full rod (F16a-252) or hollow tube,stuck along CFA

[0860] 2—A Rubberlike hollow or full tube which cross section is not afull circle, to reduce thickness (F16a-254)

[0861] 3—Two opposing solid “bands” having a J shaped width crosssection (F16b-256).

[0862] Each band covers one of the right or left halves of the FoldStrip (F16a-250).

[0863] Js' tails meet at a line above and parallel to CFA. (F16-b 258)

[0864] When the circuit board is folded, opposing Js form a U, limitingFold Curve Radius.

[0865]FIG. 16a is perspective of all above, shown on one 2-Pad E-Boardto save repetition.

[0866] Reducing the Safe Curve Radius (SCR) of a Foldable Circuit Board(FCB):

[0867] A FCB has to maintain a SCR.

[0868] Folding acutely beyond SCR can damage the “circuit” or the“flex-board” at the Fold.

[0869] This Description introduces a technique for allowing more acuteSCR.

[0870] The “flex-board” can usually withstand smaller SCR than the“circuit”.

[0871] Flex-board's SCR can be reduced by choosing softer, thinner, moreflexible material.

[0872] But the “circuit” is metallic, usually copper, with a larger,less acute SCR.

[0873] If Connecting Lines (CL) (F2-66&68) between adjoined SEBs areperpendicular to CFA (F2-68), their Curve Radius will be the same asFlex-board's CR.

[0874] But an Oblique CL at acute angle to CFA (F2-66), spreads the CRover a longer CL. Hence a less acute Curve Radius for the ConnectingLines than CR of the Flex-board. Thus Flex-board can be folded moreacutely, while the circuit maintains its SCR.

[0875] The longer the CL and the smaller the angle that CL makes withthe CFA, the smaller the Safe Curve Radius of the Foldable Circuit Boardcan be.

[0876] Another technique is to use Multiple Connecting Lines instead ofa Single Connecting Line connecting the same points on the adjacentSEBs. Thus if one line is broken due to numerous flexing and abuse, theother lines carry the current (F23-320)

[0877] This allows a more acute Safe Curve Radius than a singleConnecting Line.

[0878] Making Multiple Connecting Lines “oblique”, furthers SCRreduction ability.

[0879] Another technique is to use a Circuit Connecting Grid (CCG)(F23-322) between each two points on adjacent SEBs that need to beelectronically connected.

[0880] CCG has Multiple Connecting Lines, each line connected toadjacent line(s) at several points along its length.

[0881] Such a Grid can break in many points, but will remain connectedfrom end to end. This allows a more acute Safe Curve Radius than Singleor Multi Connecting Lines. Making CCG Olique enhances its SRC reductionability.

[0882] SRC reduction techniques can alternatively increase longevity ofcurving circuit.

[0883] For production simplicity, economy and electronic efficiency, itis a good idea to print the circuit of all the E-Board on oneFlex-board.

[0884] Even if each SEB is a separate PCB, it is easier to connect themby Flex circuits.

[0885] Above SRC reduction techniques are most useful when the FoldStrip is Flex-board.

[0886] Above techniques take us from a U-Curve to an acute U-Fold.

[0887] Elastomer Circuit Connectors (ECC):

[0888] Each SEB can be a separate Printed Circuit Board, held toadjacent SEB side physically by Non-conductive Elastomer adhered to bothSEBs along their Fold Strip. FIG. 24 shows two such holding bandsF24-330 & F24-332, holding adjacent SEBs F24-334 & F24-336 together,physically, but by themselves don't conduct electricity.

[0889] Such Non-Conductive Elastomer should preferably not strech, so alayer of non stretch fiber, such as a cloth layer better be adhered toit.

[0890] Alternatively, it can be made of any Non Stretch material thatdoes not crack under repetitive folding and unfolding, such as a clothribbon.

[0891] Electronic Connections between such SEBs is via Thin ConductiveElastomer Strips (F24-338 & F24-340), one end (F24-342) of each Strip isadhered, using conductive adhesive, to a point on one SEB.

[0892] The other end is similarly adhered to a point on the adjacentSEB, such that current can flow from one SEB to its neighbor SEB viaConductive Elastomer Strips (CES).

[0893] A sufficient number of CES provides necessary connections betweenSEB circuits. CES can be adhered to the Non-conductive Elastomer FoldStrip for more support.

[0894] Each Elastomer Circuit Connector is the combination ofNon-conductive Elastomer Fold Strip and accompanying ConductiveElastomer Strips.

[0895] Condcutive elastomers are made by doping normal elastomers,especially Silicones with Conductive particles. They are used forelectromagnetic shielding.

[0896] They have good elongation, folding and conductive properties.

[0897] However, elaongation or stretching is not necessarily needed inthis application. Elangation is a beign consequnce of using Elastomersfor their other properties. Therefore, any material that can beconductive, and can withstand repetitive acute folding and unfoldingwithout loosing its electrical and physical properties will do.

[0898] Another example of such materials are some “Conductive Polymers”.

[0899] Since there is no risk of creasing or breaking, the Fold Stripcan be very narrow, keeping adjacent SEBs very close to each other,making a more intgral E-Board. Narrower Fold Strip requires shorter CES,which increases their conductivity.

[0900] For even better conductivity, CES should be made as wide aspossible, considering the number of CES that are needed on a set lengthof the Fold Strip.

[0901] Both CES and Elastomer Fold Strip can be thinner that a fractionof mm.

[0902] Elastomer Circuit Connectors can be folded very acutely (V-fold),with no damage.

[0903] Unfold Limitor (UL):

[0904] Folding Pads of E-Board are meant to fold only face to facetowards each other.

[0905] UL is introduced here for preventing Pads from unfolding beyonddesired angle.

[0906] UL is a “foldable flexible un-stretchable thin band” (F8-122)like a ribbon.

[0907] One side of UL (F8-124) is stuck close to the right side of theFold Strip.

[0908] The other side of UL (F8-126) is stuck to the left side of theFold Strip.

[0909] UL side 124 and 126 better be stuck to the Pads, withoutobstructing any Node.

[0910] UL width when stretched, is less than the width of Fold Strip.

[0911] This keeps unfolded Pads at desired (less than 180 degrees) angleto each other.

[0912] An alternative, Thread UL (F8-128), can be stuck at each end(F8-130 &132) to anywhere along the sides of Pads, without obstructingany Node, hence can be longer.

[0913] Two Thread ULs can be used, stuck to parallel sides of E-Board,perpendicular to CFA.

[0914] UL can also be used between Integral E-Board and MCC.

[0915] UL is light, cheap, simple and thin.

[0916] Backfold Stopper (BS)

[0917] BS is a Thin Rigid Band (shown in F18), all part of its length(shaded area F18-d), is adhered to the underside of one of the adjoinedfolding Pads, substantially perpendicular to and extending to the sideof said Pad that meets the Fold Strip (FS). F18-d shows the constructionviewed from the underside of the E-Board.

[0918] Rest of its length (blank F18d-164), is longer than the width ofthe FS (F18d-160), extends across the width of FS, neither adhered to FSnor to the other Pad F18d-168.

[0919] Since both Pads and the BS are rigid, this construction stops theFS from backfolding. Since the blank peninsula is not adhered to FS,Pads' face to face folding is allowed.

[0920] BS can be integral peninsula to a Rigid (underside) Layer at theunderside of the Pad.

[0921] There can be more than one BS, attached to either or both Pads,looking like teeth.

[0922] Double BS is two opposing BSs, the total lengths of their blankparts F18d-170 and F18d-172 is longer than the width of the FS F18d-160.

[0923] F18 shows cross section of a Double BS while unfolding when Padsare:

[0924] (F18-a) folded faces to face, (F18-b) partially unfolded, (F18-c)aligned

[0925] E-Board Power Supply:

[0926] E-Board, being faster than current MCC Input Devices, savesbattery by allowing the operator to spend less of MCC time for the sameresult.

[0927] E-Board can have at least three sources of primary orsupplementary power.

[0928] 1—MCC's Power Source

[0929] 2—Thin Rechargeable or Replaceable Batteries, attached to it.

[0930] 3—Small bafteri(e) placed in/on the box, clamp or other devicethat holds it to MCC.

[0931] 4—Thin Photo Electric Cells, placed on parts of its surface

[0932] 5—Photo Electric Pad(s) connected to it or to MCC, like SubE-Board(s).

[0933] 6—Thermo Voltaic Chips, that conver body or other heat toelectricity.

[0934] TVC can be held to wrist or other parts of body for heat, byelastomers or otherwise.

[0935] It can transfere power to E-Board via a thin cable.

[0936] This Description introduces E-Board power supplies not used inMCCs before.

[0937] These techniques are applicable to MCCs and other devices too.

[0938] Photo Electric Cells can be placed on any “part”s of the E-BoardSurface that does not adversely affect electronics or operation oraccess to Nodes, such as between Nodes.

[0939] If such parts are not sufficient, then we can enlarge the E-Boardto add needed area.

[0940] We can add entire SEBs or Pads devoted to Photo Electric Cells.

[0941] Said Photo Voltaic Cells or Rechargible Thin Battries can beadhered to the E-Board. But can also be in the form of a RemovableLayer.

[0942] This power generating ability, makes an E-Board

[0943] able to operate with MCCs that do not supply ouput power

[0944] able to use a “wireless” system for electronic connection to MCC

[0945] use none or less of MCC power

[0946] add to the scarce powe supply

[0947] Hence reducing the bulk, weight or charging frequency of MCCbattery.

[0948] It may even be able to eliminate the MCC battery.

[0949] A Multi-Pad, Photo Electric, Portable Power Generator

[0950] A Photo Electric Cell (PEC) Power Source made of one or more padscan be made. Such Pads can fold over each other or be detachable fromeach other or curve around MCC for ease of transport or pocketportability using the techniques described here.

[0951] This Description has shown how to make a single or multi-PadE-Board that:

[0952] can be Detachable from or Integral to MCC

[0953] has one or more Pads

[0954] Pads can fold over each other or fold/curve over MCC withoutdamaging the circuit

[0955] Pads can be detachable from each other or from MCC for stacking

[0956] is light and thin, when folded or stacked, for pocket transport

[0957] can have a large working surface area when unfolded or assembled

[0958] can be prevented from backfolding, so as to face the light evenwhile walking

[0959] An assembly of one or more PEC Pad(s) is a Portable PowerGenerator (PPG).

[0960] One 8×14 cm pad will give enough power for a low consumption MCC.

[0961] A (3×3) 9-Pad PPS can have an area of 9×8×14=1008 squarecentimeters.

[0962] This translate into power more than 336 times a calculator's PEC.

[0963] PECs can be made a fraction of mm thick, so that a multi fold canbe few mm thick.

[0964] PEC Pads can be made very light.

[0965] Pads can have PECs on both top and undersurface, to catch lightat any angle.

[0966] Such a Power Source is useful not just for MCC but for any otherdevice.

[0967]FIG. 17 shows one version of a 9-Pad PEG, on which

[0968] Each Pad 150 is a rigid, but light and thin PEG film

[0969] Most adjacent pads are connected via a Fold Strip 148, offlexible curveable material

[0970] Fold Strips harbor Conductive Lines 144 between circuits of Pads

[0971] Backfold Preventors 146 can be provided between adjacent andconnected Pads

[0972] Generated current is directed via the Output Plug 152 to theconsuming device

[0973] One folding sequence of Pads a,b,c,d,e,f,g,h,k is (FO means foldsover)

[0974] *b-face FO a-face

[0975] *cface FO b-back

[0976] *dface FO c-back

[0977] *f-face FO a-back

[0978] *e-face FO f-back

[0979] *f-face FO d-back

[0980] *k-face FO e-back

[0981] *h-face FO k-back

[0982] For transport,the multi-fold is kept folded by Velcro, a rubberloop, etc.

[0983] Elastomer Circuit Boards (ECB):

[0984] To reduce thickness of the working surface of the E-Board, onetechnique is to choose thin material for the circuit board.

[0985] To make the E-Board flexible, one technique is to use flexiblematerial.

[0986] For multi dimensional flexibility, this Description teachesElastomer Circuit Boards.

[0987] Prior art for obtaining flexibility and thinness uses FlexCircuit Board, made of one or more layers of very thin film, such asKaptan. Flex-boards have following limitations:

[0988] They don't fold. They “crease” if folded and pressed at the fold,breaking the circuitry

[0989] They only curve or flex or roll along one axis at a time.

[0990] It is not possible to curve them along both x and y axissimultaneously.

[0991] If folded beyond a Safe Curve Radius the circuitry is damaged

[0992] They break or tear relatively easily.

[0993] Their material is expensive, to withstand conditions of circuitproduction and use.

[0994] They are not resilient enough for external use, and must becovered or protected

[0995] Said limitations don't matter when encased inside (say) afoldable flip cell phone, which only folds along one axis around a safeCurve Radius.

[0996] But they are not suitable for use as a thin E-Board, adhered touser's sleeves, or subject to creasing, abrasion, multi direction ormulti dimensional folding.

[0997] One suitable group of material to use as the “board” for “circuitboard” is Elastomers. Rubber likes s.a. Latex, Silicone, Urethane or anymaterial with following properties:

[0998] Non-electro conductive, or usable as a base for electroniccircuit to be printed on

[0999] Can be made conductive at desired locations by doping or liningwith conductives

[1000] Can be made very thin-such as latex in condoms

[1001] Can be made thicker in desired areas. Not so easy to do with flexfilms.

[1002] Cheap and abundant, compared with flex films

[1003] Resilient against physical adversaries, such as tear, erosion,abrasion, shock, pressure, hammering, heat, cold, humidity, dryness,etc.

[1004] Resilient against most chemicals

[1005] Truck tires withstand physical & chemical abuse, carrying 40 tonsfor 100,000 km

[1006] Can be folded at any tight angle without creasing

[1007] Can curve, bend or fold in multiple directions simultaneously. Arubber sheet can be folded at point “o” to create 3 planes xoy,xoz,yoz,even at acute angles.

[1008] Can contour to any 2 or 3 Dimensional shape. Flex Films can onlybe 2-D.

[1009] Can be made very soft or very hard, in desired locations. Noteasy with films

[1010] We can use soft rubber for the folding areas of E-Board, hardrubber elsewhere

[1011] Can withstand the heat and other conditions of adhering circuitsupon them.

[1012] Have all the advantages of flex films, but none of theDIPadvantages

[1013] In addition to all, Elastomers can “stretch”, in any directionand “retretch”. Stretchability, a feature not owned by flex films, isnot the same as flexibility.

[1014] Stretchability must be harnessed, otherwise the unstretchablecircuit may break.

[1015] A rubber circuit board, would not stretch unintentionally,especially if enclosed.

[1016] But if its location or use subjects it to stretching, the circuitmay be damaged.

[1017] To prevent stretching, while maintaining all other properties, wecan add one or more layers of nets or fiber mesh made of thin flexiblebut not stretchable fibers.

[1018] Examples of such fibers are cotton (natural) and Kevlar(synthetic).

[1019] Techniques for printing circuits to a Flex-board can be modifiedto Elastomers.

[1020] Conductive doping techniques can be applied to print circuitsonto Elastomers.

[1021] Another technique introduced here is as follows:

[1022] Print the mapping of intended circuit, using a conductiveflexible glue over the Elastomer's surface, by silkscreen or otheravailable technology, to.

[1023] Then spray the surface with a powder made of conductiveparticles.

[1024] Or the suface can be spread, face down over a tray filled withsuch particles.

[1025] Therefore, particles will stick to the surface along glue lines.

[1026] Let the conductive glue cure, to fix the conductive particles onthe Elastomer.

[1027] Clear excess of conductive poweder by washing, wiping or blowing.

[1028] Round condctive particles can do the job, but not the bestoption, because particles can be separated from each other due tocontour stretching of the Elasomer base.

[1029] Conductive particles better be tiny, thin, long, prefereably flatand flexible strands. Metals s.a. Gold particles and microscopic longconductive carbon tubes are suitable. Thus each strand is connected andintertwined with several other strands.

[1030] Bending and folding the surface cannot easily break multiparticle connections.

[1031] Strand particles are a better for many other conductive dopingstoo.

[1032] Contouring E-Board:

[1033] E-Board can use an Elastomer Keypad DIP, Capacitive or even someother DIP. But use Elastomer Circuit Board instead of a Printed CircuitBoard or Flex-board.

[1034] Thus it will behave like a thin sheet of rubber.

[1035] It can be sewn or velcroed to clothes, even if it has a largesurface area.

[1036] Its Elastomer can be stiffer under or above Nodes to preventuninteded contact.

[1037] Yet softer in between Nodes to allow for easy contouring alongthe supporting clothes. It can therefore house more larger and betterspaced Nodes than a typical E-Board. Field workers s.a. miners canutilize this feature.

CONCLUSIONS AND RAMIFICATIONS & SCOPE

[1038] In the interst of not being repetitive and to not to increase theunavoidable length of the Description, this section is reduced to merecompliance with protocol.

[1039] The E-Board and/or its various embodiments can achieve all theset objectives.

[1040] Several types of truly pocket portable (thin light, small), trulyfunctional fast, easy, multi finger Digital Input Board with sufficientcharacter set were described.

[1041] Various embodiments were specified, but the invention is notconfined to those. Numerous other embodiments can be derived from theDescription by the skilled. Principals are laid down to enable a personskilled in the art to create further embodiments when future needdedmaterias or other elements are introduced.

[1042] The scope of the invention is not confined to what is written,butwhatever can be created by a person skilled in the art, using all thatcan be extracted from the Description, and all the skill expected of aperson skilled in the art.

[1043] A note on claims: To eliminate any ambiguity, in multipledependent claims in this application, a “comma”, separating two claimNumber, denote “or”.

I claim: 1- A digital data input board, having a board as its main bodyon or in which a circuit is embedded an electrical or electromechnicalsystem or platform to convert an operator's finger strikes on ceratinparts of said board, into digital codes, such codes can be registerableby a data receiving device, such as a PDA or cell phone or any othermobile communicating computer, categorically referred to as MCC inspecification and claims here, said electrical or electromechanicalsystem or platform is chosen to or can be modified to become sauch as toenable said digital data input board to be constructed thin, light anduse low actuation force in operation said electrical or electromechnicalsystem or platform is prefereably a thin film capacitve or an elastomerdome array or touchscreen said digital data input board is constructedfrom elements and also desinged and modified to make its main body andpreferably all of it, thin, prefereably less than three millimetersthick, and ideally less than one mm thick, said digital data input boardis constructed from light elements to make it light, prefereably lessthan 50 grams and ideally less than 20 grams, said digital data inputboard is constructed or modified to use low actuation force foroperating it, preferably less than 85 grams, ideally less than 50 gramssaid digital data input board has a predetermined width, prefereablybelow 90 millimeter and a predetermined length, prefereably below 150mm, whereby said digital data input board, being thin, light, small andof low activation force, refrerred to in specification and claims here,as an E-Board, can be operated with ease and can be carried with ease,preferably inside a pocket, even together with an MCC. 2- An E-Board asin claim 1, some or all of its electronic components are: compacted,into one or more application specifc integrated circuits, also known asan ASICs, or placed on one or more separate chips, each chip can bedetatchable from said E-Board, or placed on an output connector whichelectronically connects said E-Board to an MCC, or in locations whichcasuse less problems for use or carrying said E-Board, or on any holdingdevice use to hald said E-Board to an MCC, or prefereably inside saidE-Board's corresponding MCC, or any technically logical combination ofabove variations, whereby making said E-Board, especially its operableworking surface, as thin and unobstructed as possible. 3- An E-Board asin claims1, 2, having several islands on its working surface, eachisland, referred to in specification and claims here as a node, having asurface which is sensitive to be activated, when touched or pressed byan operator's finger, wherein: each node has a surface shaped tosubstancially resemble the finger print of a typical finger operatingit, each node is preferably circular or regular hexagonal, each nodeoperated by thumb has a surface closely resembling a thumb print,prefereably an oval substantially close in shape and orientation to atypical operator's thumb print when touching said E-Board, therebyreducing or eliminating the number of nodes having less optimal shapes.4- An E-Board as in claims 1, 2, 3, having an insensitive zone betweenadjacent nodes, such that touching or pressing anywhere on such zonesdoes not activate said E-Board, the distance between a point on theperimeter of a node and a point on the perimeter of an adjacent node,referred to here as an inter node gap, the smallest of which for eachtwo adjacent nodes, referred to here as a minimal inter node gap,wherein, said E-Board is constructed to have all said minimal inter nodeinter node gaps to be of a size, sufficient to reduce, to apredetermined level, the probability that one strike of a single finger,even if touching more than one nodes, activating more than one node, andwherein, while observing said sufficient size for all minimal inter nodegaps, other or non minimal inter node gaps are also substantiallyreduced, thereby substantially reducing the total area of all saidinsensitve zones, whereby the overall working surface of said E-Board isreduced to a predetermined, but technically possible size. 5- An E-Boardas in claims 1, 2, 3, 4, wherein; all nodes have either a circular or aregular hexagonal surface shape, all nodes are equal in radius andtherefore in size, all nodes are arranged as closely as possible to eachother minimal inter node gaps are reduced to minimum sufficient, therebyreducing the area or eliminating those parts of insensitve zones whichare not needed to maintain sufficient minimal inter node gaps, referredto in specifcation and claims here as voids, and thereby centers of eachthree adjacent nodes forms a triangle of equal sides, whereby reducingthe overall functional size of said E-Board, by choosing an optimalshape for all nodes and arranging them most tightly. 6- An E-Board as inclaims 1, 2, 3, 4, 5, wherein the distance between centers of adjacentnodes are made large enough, prefereably 15 to 19 mm, by increasinginter node gaps or preferably by increasing the size of nodes, or by acombinationg of above, so that adjacent fingers resting on or aiming atadjacent nodes do not collide or do not jam, and whereby multi fingeroperation, also known as touch typing is possible and convenient. 7- AnE-Board as in claims 1, 2, 3, 4, 5, 6, wherein its main body andespecially its working surface is made of materils that suffice towithstand, without damage; being held by hand or by a holding devicethat may hold it together with an MCC in an operating position,repetitive finger strikes over a long enough operational life, expectedabuse and perils such as desk abrasion and pocket pressure, and wherein,if not so sufficiently resilient, a suitable, thin sturdy layer isadhered to its underside to provide such protection substantially. 8- AnE-Board, as in claims 1,2,3,4,5,6,7, which is; divided into a number ofsections, each section refered to in specification and claims here assub E-Board or as a Pad, each sub E-Board is connected physically andelectronically, via physicall and electronic connections, to at leastone adjacent sub E-Board or to an MCC, said physical and electronicconnections are detatchable and reattachable, to allow segmentation intransport and assembly in use, or prefereably, said physical andelectrica connections are flexible, so that said sub E-Boards can eitherfold over each other or curve around an MCC, along said fexibleconnections, to allow easier or pocket transport, thereby, it can belarger than pocket size, yet fold to become much smaller, Whereby saidE-Board, that may be refered to as a multi Pad E-Board, can provide moreworking surface area, yet can be folded to say pocket size, or can bewrapped around an MCC for transport and unfolded for operation. 9- AnE-Board as in claims 1,2,3,4,5,6,7,8, which is an integral part of anMCC, physically and electronically connected to said MCC, referred to inspecification and claims here as an integral E-Board. 10- An E-Board asin claims 1,2,3,4,5,6,7,8, which can be electronically attached to anMCC for operation, via an output connector said output connecter madeprefereably thin and flexible for most of its body said output connectorhas an output plug, physically and electronically suitable to fit intoan MCC's input jack or port, whereby said E-Board, referred to inspecification and claims here as a detatchable E-Board or an externalE-Board, can be physically and electronically detatched from said MCCand whereby said output connector can be regarded as a sub E-Board. 11-An E-Board as in claim 10, made operational on many types of MCCs, by;making either its output connector or prefreabily the output plugportion of its output connector detatchable, making the remainder ofsaid E-Board operable for said various MCCs, making said detatchableoutput connector or said detatchable ouput plug, in various types, eachtype to suit one type of said MCCs if necessary, modifying said E-Boarddriver to adjust to said various MCCs. 12- An E-Board as in claims1,2,3,4,5,6,7,8,9,10,11, optionally having one or more of; a touch padto be used as a mouse a hand writing recognition pad scroll function orfunctions cursur funtion other useful functions thereby, said E-Boardcan perform some or all of functions typically performed by keys or atouchpad, occupying the working surface of an MCC, allowing a largerscreen, and thereby some of above options can eliminate the need for atouchscreen, Whereby the overall thickeness, bulk and perhaps cost ofsaid E-Boards corresponding MCC can be reduced. 13- An E-Board as inclaims 1,2,3,4,5,6,7,8,9,10,11,12, having flexible connectionsconnecting it to an MCC or if it is a multi pad E-Board connecting someor all of its sub E-Boards to an adjacent sub E-Board, wherein; some orall of those connections have means, protecting said connections fromfolding too acutely so as not to be damaged said means are refered to inspecification and claims here as circuit curve limitor optionally, someor all of those connections have devices, protecting the flexible areaor areas of said E-Board's circuit board from being creased or, crackedsaid devices are referred to in specification and claims here as circuitcrease protector thereby reducing damage caused by repetitive flexingfolding and unfolding. 14- An E-Board as in claims1,2,3,4,5,6,7,8,9,10,11,12,13, having flexible connections connecting toto an MCC or if it is a muti pad E-Board, connecting some or all of itssub E-Boards to an adjacent sub E-Board, wherein some or all of saidconnections use means or methods to enable them to fold acutely, or toreduce the safe radious of curve along said flexible connections,without sustaining damage, thereby along with other advantages, makingsaid E-Board and or its combination with an MCC, more pocket portable.15- An E-Board as in 1,2,3,4,5,6,7,8,9,10,11,12,13,14 having thin,photovoltaic cells, or thin replaceable or rechargeable batteries,disposed over some or all of its surface, in locations where such photovolctaic cells do not interfere neither electronically nor physically,with operation of said E-Board, and that said photo voltaic cells orsaid rechargible thin battries can be integral to said E-Board, but maybe removeable, thereby said E-Board can connect wirelessly with to anMCC, connect to an MCC that does not provide power to said E-Boardprovide some or all of power needed by said E-Board potentially providesome or all of power needed by an MCC, whereby reducing need for,weight, bulk and recurrent charging of an MCC battery. 16- An E-Board asin claims 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15, having a fuction todetermine the location of a cursur on an MCC screen at a time, referredto in specification and claims here as a pointer function or a cursurfunction, said function being made possible by; three, preferably fouror more small nodes, said small nodes are close to each other so thatone finger can roll from one to the next with minimal movement,preferably simultaneously means to measure intensity of touch at any ofsaid small nodes, using some compound or simple measure of intensity,such as duration of touch means, to determine the position of a cursuron an MCC screen, at any time during the operation of said pointerfunction said means can also register a selected position for saidcursur, by signals such as removing or tapping of finger said means,wether software, hardware or combination of both, may be housed in saidE-Board or in said MCC or in a combination of both, whereby the need,weight, thickness and cost of an MCC touchscreen and accompanying stylusthat typically perform said function may be saved. 17- An E-Board as inclaims 1,2,3,4,5,6,7,9,10,11,12,15, using; a transparent digitial datainput platform or system, such as touchscreen or prefereably transparentthin film capacitive, having markings to identify characters, functionsor territory of each node which markings are made pale and transparentby use of any of; transparent pale colors, paints, pigmentation orlayer, or some combination material or electric screens whosetransparency can be controlled, which markings are prefereably softwaregenerated, to enable an operator to generate or delete them at will saidE-Board can be placed over the screen of an MCC or a notepad for usesaid E-Board can be adhered to an MCC or notepad screen another versionof said E-Board can be detatchable from an MCC or notepad, thereby, saidE-Board does not block viewing an MCC or notepad screen, and therebysaid E-Board can use the screen of an MCC as its holder and operationallocation, with minimal reduction in utility of said screen, whereby saidtransparent E-Board need not reduce the actual or functional size of anMCC or notepad screen on which it is operating. 18- An E-Board as inclaims 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17, a minority of itsnodes are larger, a different shape, are not as closely placed toadjacent node or nodes, or have any combination of above threecharachteristics, or being in some aspects, different than remainingmajority, so as to make those minority nodes more suitable for thumb orcertain characters or functions, thereby increasing the overallefficiency of said E-Board. 19- An E-Board as in claims 1,2,3,4,5,6,7,9,10,11,12,13,14,15,16,17,18, wherein; its width and length are smallenough to fit into a normal shirt pocket, its width is prefereably lessthan 75 mm, its length is prefereably less than 130 mm, it is suitablefor operation by one hand wheby said E-Board, being pocket size andsuitable for one hand operation, referred to in specification and claimshere as an E-Pad, is an operational, pocket portable, digital data inputboard. 20- An E-Board as in claims1,2,3,4,5,6,7,9,11,12,13,14,15,16,17,18 or 19 which; is an integral partof an MCC, is not a multi pad E-Board is electronically connected tosaid MCC, one side of it is physically connected to a suitable side ofsaid MCC, can pivot, around an axis which is substantially close andparallel to said side, in one direction to cover said MCC's screen, andin the opossite direction to be firmly in operational position, wherebysaid integral E-Board which is an E-Pad, refered to in specification andclaims here as an integral E-Pad, can be operated by one hand while saidMCC is carried by the other hand. 21- An E-Board as in claim1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20, having a controller,and means to reject any node that may have been activatedunintentionally so as to register only one node or only one naturallyacceptable combination of activated nodes at a time, said meanspreferably resident in said controller, but may be embedded in a driveror MCC. 22- An E-Board as in1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21, having one ormore nodes which generate one character or function when activatedbefore or after another node, thereby multiplying the number ofcharacters and functions that can be generated by said E-Board, but saidnode need not be held activated from before until after said other nodeis activated, thereby freeing the finger operating it to perform otheractivations, whereby the ease and speed of operation is increased,especially in those E-Boards that can be operated conveniently only byone hand or limited number of fingers. 23- A method of marking anE-Board working suface area, so as to increase the speed of locating anintended character or funtion or node on said E-Board, using anycombination of following steps for some or all of nodes: determining thebiggest territory allocated to each node and drawing one visible line tomark said territorial boundarie between said node and adjacent ones, sothat eyes may target larger territories than pinpointing nodes usingcontinuous, lines to mark said territorial boundaries making said linesthinly raised for a three dimentional effect marking such that each nodeis substantially centeral within its territory, so that a finger aimingat said territory is more likely to touch the node within making nodesinvisible so that eyes don't search for them providing largerterritories to more used nodes, regardless of node size placing thumterritory on the bottom row of nodes, placing thumb node in a one padE-Board at a suitable lower corner of the working surface of said E-Padallocating more used functions to an extreme left or rigt node on a rowwhereby difficulty in locating almost 2 dimentional nodes is reduced.24- A method of reducing or eliminating the probability of unintendedactivation of nodes on an E-Board, caused by one or more fingersactivating one or more nodes erroneously, by programming said E-Board'sdriver, said E-Board's controller, corresponding MCC's operating system,corresponding MCC's hardware or any technically viable combination ofsaid options, prefereably the controler of said E-Board, to select, onlyone of a multiple of nodes that are activated concurrently, saidselection is done by measuring; time interval within which said nodeswere activated physical distance between each two of said activatednodes order in which said nodes were activated duration which eachactivated node remained activated or touched intensity of touch, asmeasured by factors which largely depend on the digital data inputplatform or system, such factors can be capacitance change, reistancechange, node surface area touched, pressure applied, other factors, or atechnically viable weighted combination of above factors, then using analgorithm, from a variety of algoriths that can be devised, tomanipulate said measurements to accept any natural concurrentactivation, such as shift and another node, and reject certainconcurrent activation, and select the node to be registered, one suchalgorithm being; identify all nodes activated within a shortpredetermined time interval choose those nodes activated with apredetermined intensity or higher accept any acceptable combination ofactivated nodes from the combination of those chosen and those accepted,select the first node which was activated, thereby need for any gapsbetween nodes is reduced or eliminated, need for corrections is reduced,the speed of operation is increased, nodes can be made very small, nodescan be packed very compactly, and other advantages can be derived,whereby a very small E-Board can be made functional and fast. 25- Amethod as in 24, generalized not to be limited to E-Board, thereby itcan be applied to any digitial data input device, such as a keyboard,and whereby all said devices can enjoy its advantages, in particularconstruction of ultra small, yet fast and functional digitital datainput devices can be achieved. 26- A method of reducing the overalllateral movement of figers on an E-Board, by; identifying home nodesmost conveniently touchable said home nodes can be on different rowsordering fingers by how active they can be said ordering of fingers maybe by research, analysis or experimentation said ordering of fingers maybe by how close they are to the thumb ordering characters and functionsin order of frequency of use, using research, analysis andexperimentation, for the particular field of use of said E-Boardallocating most used characters or functions to home nodes of mostactive fingers, in logical correlation to achieve the goal of thismethod allocating remaining characters and functions, in order orfrequency of use, to those nodes most conveniently reachable from a homenode, the higher the frequency of use, the more active the fingercontinue until all nodes are allocated to characters or functionsallocate remaining lesser used characters and functions to a secondaryset which set can be reached by first activating a prior character suchas alt continue to third set and so on thereby, the overall speed ofoperating an E-Board is increased. 27- A method as in claim 26,generalized to apply to any digital data input device.